Optoelectronic Chip Assembly Process of Optical MCM
Tokunari, Masao, Masuda, Koji, Hsiang-Han Hsu, Hisada, Takashi, Nakagawa, Shigeru, Langlois, Richard, Jacques, Patrick, Fortier, Paul
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Fluid control structure
Masuda, Koji, Hisada, Takashi, Fortier, Paul F, Tokunari, Masao, Cyr, Elaine, Jacques, Patrick
Year of Publication 07.04.2020
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Year of Publication 07.04.2020
Patent
Reduction of stress in via structure
Aoki, Toyohiro, Horibe, Akihiro, Nakamura, Eiji I, Hisada, Takashi, Sueoka, Kuniaki, Hada, Sayuri
Year of Publication 17.03.2020
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Year of Publication 17.03.2020
Patent
Single glass panel for fire door and double glazed glass panel for fire door
Hisada, Takashi, Nishikawa, Sachiko, Suzuki, Kazuyuki, Yokota, Takashi
Year of Publication 01.05.2018
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Year of Publication 01.05.2018
Patent
METHOD OF FORMING SOLDER BUMPS
Orii Yasumitsu, Mori Hiroyuki, Nakamura Eiji, Aoki Toyohiro, Hisada Takashi
Year of Publication 15.03.2018
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Year of Publication 15.03.2018
Patent
METHOD OF FORMING SOLDER BUMPS
Orii Yasumitsu, Mori Hiroyuki, Nakamura Eiji, Aoki Toyohiro, Hisada Takashi
Year of Publication 15.03.2018
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Year of Publication 15.03.2018
Patent
METHOD OF FORMING SOLDER BUMPS
Orii Yasumitsu, Mori Hiroyuki, Nakamura Eiji, Aoki Toyohiro, Hisada Takashi
Year of Publication 15.03.2018
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Year of Publication 15.03.2018
Patent
Bonding of bridge to multiple semiconductor chips
MORI, HIROYUKI, WATANABE, TAKAHITO, AOKI, TOYOHIRO, HORIBE, AKIHIRO, HISADA, TAKASHI
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
SILICIUMGREIFER MIT LASERTRENNSCHICHTEN
Miyazawa, Risa, Horibe, Akihiro, Hisada, Takashi, Knickerbocker, John, Belyansky, Michael, Chen, Qianwen
Year of Publication 18.07.2024
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Year of Publication 18.07.2024
Patent
Mechanical properties of Sn-58Bi, In-3Ag and SAC305 solders measured with fine diameter specimens
Hisada, Takashi, Shohji, Ikuo, Yamada, Yasuharu, Toriyama, Kazushige, Ueno, Mamoru
Published in 2013 3rd IEEE CPMT Symposium Japan (01.11.2013)
Published in 2013 3rd IEEE CPMT Symposium Japan (01.11.2013)
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Conference Proceeding
Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
Aoki, Toyohiro, Hisada, Takashi, Nakamura, Eiji, Yamada, Yasuharu, Mori, Hiroyuki, Orii, Yasumitsu, Takahashi, Seiichirou, Mukawa, Jun, Kobata, Chihiro, Ohkita, Kenzou, Hasegawa, Koichi
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Fluid control structure
Masuda, Koji, Hisada, Takashi, Fortier, Paul F, Tokunari, Masao, Cyr, Elaine, Jacques, Patrick
Year of Publication 06.08.2019
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Year of Publication 06.08.2019
Patent
REDUCTION OF STRESS IN VIA STRUCTURE
Aoki, Toyohiro, Horibe, Akihiro, Nakamura, Eiji I, Hisada, Takashi, Sueoka, Kuniaki, Hada, Sayuri
Year of Publication 11.07.2019
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Year of Publication 11.07.2019
Patent