Silicon handler with laser-release layers
Miyazawa, Risa, Belyansky, Michael P, Horibe, Akihiro, Hisada, Takashi, Knickerbocker, John, Chen, Qianwen
Year of Publication 20.02.2024
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Year of Publication 20.02.2024
Patent
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
Horibe, Akihiro, Watanabe, Takahito, Marushima, Chinami, Mori, Hiroyuki, Kohara, Sayuri, Yu, Roy, Bergendahl, Marc, Magbitang, Teddie, Wojtecki, Rudy, Taneja, Divya, Godard, Maxime, Pulido, Claudia Cristina Barrera, de Sousa, Isabel, Sikka, Kamal, Hisada, Takashi
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
SILICON HANDLER WITH LASER-RELEASE LAYERS
HORIBE, Akihiro, CHEN, Qianwen, BELYANSKY, Michael, HISADA, Takashi, MIYAZAWA, Risa, KNICKERBOCKER, John
Year of Publication 08.06.2023
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Year of Publication 08.06.2023
Patent
SILICON HANDLER WITH LASER-RELEASE LAYERS
Belyansky, Michael P, Horibe, Akihiro, Hisada, Takashi, Knickerbocker, John, Chen, Qianwen, MIYAZAWA, RISA
Year of Publication 08.06.2023
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Year of Publication 08.06.2023
Patent
Flip chip joining with low temperature solders and thermal gradient bonding
Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Yamamichi, Shintaro
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
Low Cost and High Density Packaging Technologies for Ultra Small IoT Computing Systems
Mori, Hiroyuki, Aoki, Toyohiro, Nakamura, Eiji, Horibe, Akihiro, Sueoka, Kuniaki, Hisada, Takashi
Published in 2019 Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2019)
Published in 2019 Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2019)
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Conference Proceeding