MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
Horibe, Akihiro, Hisada, Takashi, Marushima, Chinami, Watanabe, Takahito
Year of Publication 28.09.2023
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Year of Publication 28.09.2023
Patent
MULTICHIP INTERCONNECT PACKAGE
MARUSHIMA, CHINAMI, Horibe, Akihiro, Aoki, Toyohiro, Hisada, Takashi, Watanabe, Takahito
Year of Publication 28.09.2023
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Year of Publication 28.09.2023
Patent
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
Horibe, Akihiro, Aoki, Toyohiro, Hisada, Takashi, Mori, Hiroyuki, Watanabe, Takahito
Year of Publication 21.09.2023
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Year of Publication 21.09.2023
Patent
Bonding of bridge to multiple semiconductor chips
Horibe, Akihiro, Aoki, Toyohiro, Hisada, Takashi, Mori, Hiroyuki, Watanabe, Takahito
Year of Publication 22.08.2023
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Year of Publication 22.08.2023
Patent
Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)
Sikka, Kamal, Sousa, Isabel De, Jain, Aakrati, Marushima, Chinami, Aoki, Toyohiro, Kohara, Sayuri, Mori, Hiroyuki, Hisada, Takashi
Published in 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (06.03.2022)
Published in 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (06.03.2022)
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Conference Proceeding
UNDERFILL VACUUM PROCESS
HORIBE, Akihiro, HISADA, Takashi, MIYAZAWA, Risa, MARUSHIMA, Chinami, AOKI, Toyohiro
Year of Publication 15.06.2023
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Year of Publication 15.06.2023
Patent
UNDERFILL VACUUM PROCESS
MARUSHIMA, CHINAMI, Aoki, Toyohiro, Horibe, Akihiro, Hisada, Takashi, MIYAZAWA, RISA
Year of Publication 08.06.2023
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Year of Publication 08.06.2023
Patent
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
Chowdhury, Prabudhya Roy, Sakuma, Katsuyuki, Raghavan, Sathya, Bergendahl, Marc, Sikka, Kamal, Kohara, Sayuri, Hisada, Takashi, Mori, Hiroyuki, Taneja, Divya, De Sousa, Isabel
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Silicon handler with laser-release layers
John Knickerbocker, Qianwen Chen, Risa Miyazawa, Akihiro Horibe, Michael Belyansky, Takashi Hisada
Year of Publication 04.09.2024
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Year of Publication 04.09.2024
Patent
Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
Aoki, Toyohiro, Nakamura, Eiji, Kohara, Sayuri, Marushima, Chinami, Sueoka, Kuniaki, Hisada, Takashi, Yamaguchi, Ryota, Sekine, Nobuhiro, Yatsugi, Kenichi, Yada, Makoto
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
Horibe, Akihiro, Aoki, Toyohiro, Hisada, Takashi, Mori, Hiroyuki, Watanabe, Takahito
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
HORIBE, Akihiro, HISADA, Takashi, WATANABE, Takahito, AOKI, Toyohiro, MORI, Hiroyuki
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent