PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 22.01.2009
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Year of Publication 22.01.2009
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 11.11.2008
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Year of Publication 11.11.2008
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 11.11.2008
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Year of Publication 11.11.2008
Patent