Effects of N Doping in Ru-Ta on Barrier Property and Reliability Performance for Cu Interconnects
Torazawa, Naoki, Hinomura, Tooru, Hirao, Shuji, Kobori, Etsuyoshi, Korogi, Hayato, Matsumoto, Susumu
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
High-Performance Extremely Low-k Film Integration Technology with Metal Hard Mask Process for Cu Interconnects
Torazawa, Naoki, Matsumoto, Susumu, Harada, Takeshi, Morinaga, Yasunori, Inagaki, Daisuke, Kabe, Tatsuya, Hirao, Shuji, Seo, Kohei, Suzuki, Shigeru, Korogi, Hayato, Okamura, Hideaki, Kanda, Yusuke, Watanabe, Masayuki, Matsumoto, Muneyuki, Hagihara, Kiyomi, Ueda, Tetsuya
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
Effects of Ru-Ta Alloy Barrier on Cu Filling and Reliability for Cu Interconnects
Mori, Kenichi, Ohmori, Kazuyuki, Torazawa, Naoki, Hirao, Shuji, Kaneyama, Syutetsu, Korogi, Hayato, Maekawa, Kazuyoshi, Fukui, Shoichi, Tomita, Kazuo, Inoue, Makoto, Chibahara, Hiroyuki, Imai, Yukari, Suzumura, Naohito, Asai, Koyu, Kojima, Masayuki
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding
Effects of N doping in Ru-Ta alloy barrier on film property and reliability for Cu interconnects
Torazawa, N., Hinomura, T., Mori, K., Koyama, Y., Hirao, S., Kobori, E., Korogi, H., Maekawa, K., Tomita, K., Chibahara, H., Suzumura, N., Asai, K., Miyatake, H., Matsumoto, S.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding