Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
Duch, Susanne, Osterwald, Frank, Rudzki, Jacek, Schefuss, Frank, Hinrich, Andreas, Bachmann, Christian, Schäfer, Michael, Benning, David, Ulrich, Holger, Becker, Martin, Miric, Anton, Paulsen, Lars
Year of Publication 14.04.2020
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Year of Publication 14.04.2020
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METHOD FOR PRODUCING A SUBSTRATE ADAPTER AND FOR CONTACTING A SEMICONDUCTOR ELEMENT
SCHÄFER, Michael, BLEIFUSS, Martin, ULRICH, Holger, HINRICH, Andreas, RUDZKI, Jacek, SCHEFUSS, Frank, OSTERWALD, Frank, PAULSEN, Lars, BACHMANN, Christian, KLEIN, Andreas Steffen, WIESELER, Elisa, BECKER, Martin, KRÜGER, Frank, BENNING, David
Year of Publication 25.11.2020
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Year of Publication 25.11.2020
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METHOD FOR PRODUCING A SUBSTRATE ADAPTER, SUBSTRATE ADAPTER AND METHOD FOR CONTACTING A SEMICONDUCTOR ELEMENT
SCHÄFER, Michael, BLEIFUSS, Martin, KLEIN, Andreas, ULRICH, Holger, KRILL, Elisa, HINRICH, Andreas, RUDZKI, Jacek, SCHEFUSS, Frank, OSTERWALD, Frank, PAULSEN, Lars, BACHMANN, Christian, BECKER, Martin, BENNING, David
Year of Publication 20.11.2019
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Year of Publication 20.11.2019
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CARRIER AND CLIP EACH HAVING SINTERABLE, SOLIDIFIED PASTE FOR CONNECTION TO A SEMICONDUCTOR ELEMENT, CORRESPONDING SINTERING PASTE, AND CORRESPONDING PRODUCTION METHOD AND USE
BENEDIKT Michael, HINRICH Andreas, KREBS Thomas, BRAND Alexander, KLEIN Andreas, BLEIFUSS Martin, SCHMITT Wolfgang, SCHÄFER Michael
Year of Publication 27.04.2017
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Year of Publication 27.04.2017
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CARRIER AND CLIP EACH HAVING SINTERABLE, SOLIDIFIED PASTE FOR CONNECTION TO A SEMICONDUCTOR ELEMENT, CORRESPONDING SINTERING PASTE, AND CORRESPONDING PRODUCTION METHOD AND USE
SCHÄFER, Michael, BLEIFUSS, Martin, BENEDIKT, Michael, KREBS, Thomas, KLEIN, Andreas, SCHMITT, Wolfgang, HINRICH, Andreas, BRAND, Alexander
Year of Publication 01.02.2017
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Year of Publication 01.02.2017
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METHOD FOR CONNECTING A SUBSTRATE ARRANGEMENT TO AN ELECTRONIC COMPONENT USING A PREFIXATION AGENT APPLIED ONTO A CONTRACTING MATERIAL LAYER, CORRESPONDING SUBSTRATE ARRANGEMENT, AND METHOD FOR PRODUCING SAME
SCHÄFER, Michael, BACHMANN, Christian, MIRIC, Anton, BECKER, Martin, DUCH, Susanne, ULRICH, Holger, HINRICH, Andreas, BENNING, David, RUDZKI, Jacek, SCHEFUSS, Frank, OSTERWALD, Frank, PAULSEN, Lars
Year of Publication 15.08.2018
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Year of Publication 15.08.2018
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ARRANGEMENT OF A SUBSTRATE FOR CONNECTION WITH AN ELECTRONIC COMPONENT
KLEIN, Andreas Steffen, BECKER, Martin, SCHEFUSS, Frank, HINRICH, Andreas
Year of Publication 16.10.2019
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Year of Publication 16.10.2019
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LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT
KOCK WULF, KLEIN ANDREAS, KRUEGER FRANK, HINRICH ANDREAS, DITZEL ECKHARD
Year of Publication 22.08.2013
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Year of Publication 22.08.2013
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METHOD FOR CONNECTING A SUBSTRATE ARRANGEMENT WITH AN ELECTRONIC COMPONENT BY SINTERING USING A PRE-FIXING AGENT ON A SINTERING CONTACT MATERIAL LAYER, CORRESPONDING SUBSTRATE ARRANGEMENT AND METHOD OF MANUFACTURING THEREOF
Osterwald, Frank, Rudzki, Jacek, Schefuss, Frank, Miric, Anton-Zoran, Hinrich, Andreas, Bachmann, Christian, Schäfer, Michael, Benning, David, Ulrich, Holger, Becker, Martin, Duch, Susanne Klaudia, Paulsen, Lars
Year of Publication 10.08.2022
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Year of Publication 10.08.2022
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