A method for the manufacture of a substrate arrangement a substrate arrangement a method for bonding an electronic component with a substrate arrangement and an electronic component
SCHAEFER MICHAEL, HINRICH ANDREAS, SCHMITT WOLFGANG, BARRERA MARIN MARIA ISABEL
Year of Publication 12.10.2016
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Year of Publication 12.10.2016
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METHOD FOR PRODUCING A SEMICONDUCTOR ELEMENT WITH SUBSTRATE ADAPTER, SEMICONDUCTOR ELEMENT WITH SOLID SUBSTRATE ADAPTER AND METHOD FOR CONTACTING A SEMICONDUCTOR ELEMENT
SCHAEFER MICHAEL, WIESELER ELISA, KLEIN ANDREAS, BLEIFUSS MARTIN, HINRICH ANDREAS
Year of Publication 02.06.2016
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Year of Publication 02.06.2016
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CARRIER AND CLIP EACH HAVING SINTERABLE SOLIDIFIED PASTE FOR CONNECTION TO A SEMICONDUCTOR ELEMENT CORRESPONDING SINTERING PASTE AND CORRESPONDING PRODUCTION METHOD AND USE
SCHAEFER MICHAEL, KLEIN ANDREAS, BLEIFUSS MARTIN, KREBS THOMAS, BENEDIKT MICHAEL, HINRICH ANDREAS, SCHMITT WOLFGANG, BRAND ALEXANDER
Year of Publication 06.12.2016
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Year of Publication 06.12.2016
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LAMINATE COMPRISING AN INTEGRATED ELECTRONIC COMPONENT
KOCK WULF, KLEIN ANDREAS, KRUEGER FRANK, HINRICH ANDREAS, DITZEL ECKHARD
Year of Publication 10.07.2013
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Year of Publication 10.07.2013
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