Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions
Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Umezawa, Hitoshi, Higurashi, Eiji
Published in Scripta materialia (15.01.2021)
Published in Scripta materialia (15.01.2021)
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Journal Article
Room temperature bonding of GaN and diamond substrates via atomic layer
Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Shirayanagi, Yusuke, Hiza, Shuichi, Nishimura, Kunihiko, Higurashi, Eiji
Published in Scripta materialia (01.07.2022)
Published in Scripta materialia (01.07.2022)
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Journal Article
High-Speed InP/InGaAsSb DHBT on High-Thermal-Conductivity SiC Substrate
Shiratori, Yuta, Hoshi, Takuya, Ida, Minoru, Higurashi, Eiji, Matsuzaki, Hideaki
Published in IEEE electron device letters (01.06.2018)
Published in IEEE electron device letters (01.06.2018)
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Journal Article
Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method
Takigawa, Ryo, Higurashi, Eiji, Asano, Tanemasa
Published in Japanese Journal of Applied Physics (01.06.2018)
Published in Japanese Journal of Applied Physics (01.06.2018)
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Journal Article
Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions
Matsumae, Takashi, Takigawa, Ryo, Kurashima, Yuichi, Takagi, Hideki, Higurashi, Eiji
Published in Scientific reports (27.05.2021)
Published in Scientific reports (27.05.2021)
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Journal Article
Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation
Kurashima, Yuichi, Matsumae, Takashi, Higurashi, Eiji, Yanagimachi, Sinya, Kusui, Takaaki, Watanabe, Mitsuhiro, Takagi, Hideki
Published in Microelectronic engineering (01.02.2021)
Published in Microelectronic engineering (01.02.2021)
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Journal Article
Ultrathin adhesive layer between LiNbO3 and SiO2 for bonded LNOI waveguide applications
Takigawa, Ryo, Higurashi, Eiji, Asano, Tanemasa
Published in Japanese Journal of Applied Physics (01.08.2019)
Published in Japanese Journal of Applied Physics (01.08.2019)
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Journal Article
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging
Matsumae, Takashi, Kariya, Shingo, Kurashima, Yuichi, Thu, Le Hac Huong, Higurashi, Eiji, Hayase, Masanori, Takagi, Hideki
Published in Sensors (Basel, Switzerland) (24.10.2022)
Published in Sensors (Basel, Switzerland) (24.10.2022)
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Journal Article
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films
Yamamoto, Michitaka, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Itoh, Toshihiro, Higurashi, Eiji
Published in Micromachines (Basel) (13.02.2019)
Published in Micromachines (Basel) (13.02.2019)
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Journal Article
An Ultra-Compact MEMS Pirani Sensor for In-Situ Pressure Distribution Monitoring
Zhang, Lan, Lu, Jian, Takagi, Hideki, Matsumoto, Sohei, Higurashi, Eiji
Published in Micromachines (Basel) (07.10.2022)
Published in Micromachines (Basel) (07.10.2022)
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Journal Article
Properties of various plasma surface treatments for low-temperature Au-Au bonding
Yamamoto, Michitaka, Higurashi, Eiji, Suga, Tadatomo, Sawada, Renshi, Itoh, Toshihiro
Published in Japanese Journal of Applied Physics (01.04.2018)
Published in Japanese Journal of Applied Physics (01.04.2018)
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Journal Article