High Thermal Die-Attach Paste Development for Analog Devices
Higaki, Kiichiro, Takahashi, Toru, Ono, Akinori, Koike, Daisuke, Hori, Masahiko, Kusaka, Keiichi, Nishi, Takayuki, Mori, Takeshi
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
A novel Wafer level Fan-out Package (WFOP™) applicable to 50um pad pitch interconnects
Hayashi, N., Takahashi, T., Shintani, N., Kondo, T., Marutani, H., Takehara, Y., Higaki, K., Yamagata, O., Yamaji, Y., Katsumata, A., Hiruta, Y.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
OIDA MITSURU, HIGAKI KIICHIRO, SUGIHARA KOICHI, MURAKAMI KATSUYA, SAWACHI SHIGENORI
Year of Publication 18.03.2010
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Year of Publication 18.03.2010
Patent
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
OIDA MITSURU, HIGAKI KIICHIRO, SUGIHARA KOICHI, MURAKAMI KATSUYA, SAWACHI SHIGENORI
Year of Publication 11.02.2010
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Year of Publication 11.02.2010
Patent