Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW)
Satake, Yoshiaki, Funaki, Tatsuya, Kobinata, Kyosuke, Matsuno, Hitoshi, Hidaka, Seiji, Abe, Shunsuke, Ito, Hiroyuki, Hsiao, Chih-Cheng, Li, Sheng Yi, Kim, Youngsuk, Ohba, Takayuki
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling
Jatlaoui, Mohamed Mehdi, Hidaka, Seiji, Kasai, Ryo, Kubota, Sho, Takesawa, Masato, Muller, Charles, Lallemand, Florent, Abe, Shunsuke, Takeuchi, Takashi, Matsuno, Hitoshi
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
HIGH FREQUENCY DEVICE, HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
SAKAMOTO, KOICHI, MUKAIYAMA, KAZUTAKA, TAKIZAWA, KOICHI, HIDAKA, SEIJI
Year of Publication 14.09.2006
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Year of Publication 14.09.2006
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