Study on high density interconnect with organic build up substrate
Torii, Takuya, Inoue, Masahiro, Miyamoto, Erina, Hida, Toshinori
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Get full text
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding