by Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F. M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.
Published in IEEE transactions on electron devices (01.11.2018)

by Zhang, W., Brongersma, S. H., Heylen, N., Beyer, G., Vandervorst, W., Maex, K.
Published in Journal of the Electrochemical Society (2005)

by Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.
Published in Microelectronic engineering (01.05.2011)

by Sinapi, F., Heylen, N., Travaly, Y., Vereecke, G., Baklanov, M., Kesters, E., Van Hoeymissen, J., Hernandèz, J.L., Beyer, G., Fischer, P.
Published in Microelectronic engineering (01.11.2007)

by Gueneau de Mussy, J.-P., Bottiglieri, G., Heylen, N., Carbonell, L., O’Dell, J., Agnihotri, D. K., Tokar, A., Mazor, I.
Published in Journal of the Electrochemical Society (2006)

by Gupta, A., Radisic, D., Maes, J. W., Pedreira, O. Varela, Soulie, J-P., Jourdan, N., Mertens, H., Bandyopadhyay, S., Le, Q. T., Pacco, A., Heylen, N., Vandersmissen, K., Devriendt, K., Zhu, C., Datta, S., Sebaai, F., Wang, S., Mousa, M., Lee, J., Geypen, J., De Wachter, B., Chehab, B., Salahuddin, S. M., Murdoch, G., Biesemans, S., Tokei, Zs, Litta, E. Dentoni, Horiguchi, N.
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)

by Lemaire, F., Janssen, L., Marain, N., Heylen, N., Koshy, P., Vanstapel, A., Ronsmans, S., Ghosh, M., Hoet, P.
Published in Toxicology letters (01.09.2024)

by Heylen, N, Vincent, L-M, Devos, V, Dubois, V, Remacle, C, Trouet, A
Published in International journal of oncology (01.04.2002)

by Porret, C., Everaert, J.-L., Schaekers, M., Ragnarsson, L.-A., Hikavyy, A., Rosseel, E., Rengo, G., Loo, R., Khazaka, R., Givens, M., Piao, X., Mertens, S., Heylen, N., Mertens, H., De Carvalho Cavalcante, C. Toledo, Sterckx, G., Brus, S., Mehta, A. Nalin, Korytov, M., Batuk, D., Favia, P., Langer, R., Pourtois, G., Swerts, J., Litta, E. Dentoni, Horiguchi, N.
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)

by Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B
Published in 2010 Symposium on VLSI Technology (01.06.2010)

by van der Veen, Marleen H., Pedreira, O. Varela, Heylen, N., Jourdan, N., Lariviere, S., Park, S., Struyf, H., Tokei, Zs, Lei, W., Pethe, S., Hwang, S., Chen, F., Wu, Z., Machillot, J., Cockburn, A., Jansen, A.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)

by van der Veen, Marleen H., Jourdan, N., Gonzalez, V. Vega, Wilson, C. J., Heylen, N., Pedreira, O. Varela, Struyf, H., Croes, K., Bommels, J., Tokei, Zs
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)

by Gupta, A., Pedreira, O. Varela, Tao, Z., Mertens, H., Radisic, D., Jourdan, N., Devriendt, K., Heylen, N., Wang, S., Chehab, B., Jang, D., Hellings, G., Sebaai, F., Lorant, C., Teugels, L., Peter, A., Chan, BT, Schleicher, F., Demonie, I., Marien, P., Sepulveda, A., Richard, O., Nagesh, N., Lesniewska, A., Lazzarino, F., Ryckaert, J., Morin, P., Altamirano-Sanchez, E., Murdoch, G., Bommels, J., Demuynck, S., Na, M. H, Tokei, Z., Biesemans, S., Litta, E. Dentoni, Horiguchi, N.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)

by Tokei, Zs, Vega, V., Murdoch, G., O'Toole, M., Croes, K., Baert, R., Veen, M. Van der, Adelmann, C., Soulie, J. P., Boemmels, J., Wilson, C., Park, S. H., Sankaran, K., Pourtois, G., Sweerts, J., Paolillo, S., Decoster, S., Mao, M., Lazzarino, F., Versluijs, J., Blanco, V., Ercken, M., Kesters, E., Le, Q-T., Holsteyns, F., Heylen, N., Teugels, L., Devriendt, K., Struyf, H., Morin, P., Jourdan, N., Elshocht, S. Van, Ciofi, I., Gupta, A., Zahedmanesh, H., Vanstreels, K., Na, M. H.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)

by Belmonte, A., Kim, W., Chan, Bt, Heylen, N., Fantini, A., Houssa, M., Jurczak, M., Goux, L.
Published in 2013 5th IEEE International Memory Workshop (01.05.2013)

by Heylen, N, Baurain, R, Remacle, C, Trouet, A
Published in Clinical & experimental metastasis (01.02.1998)

by Vega-Gonzalez, V., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Wilson, C. J., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Briggs, B., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Decoster, S., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)

by BADENES, G, ROOYACKERS, R, AUGENDRE, E, VANDAMME, E, PERELLO, C, HEYLEN, N, GRILLAERT, J, DEFERM, L
Published in Journal of the Electrochemical Society (01.10.2000)

by Vega-Gonzalez, V., Montero, D., Versluijs, J., Pedreira, O. Varela, Jourdan, N., Puliyalil, H., Chehab, B., Peissker, T., Haider, A., Batuk, D., Martinez, G. T., Geypen, J., Le, Q. T., Bazzazian, N., Heylen, N., van der Veen, M., El-Mekki, Z., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Gillijns, W., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Ciofi, I., De Wachter, B., Swerts, J., Grieten, E., Ercken, M., Kim, R., Croes, K., Leray, P., Jaysankar, M., Nagesh, N., Ramakers, L., Murdoch, G., Park, S., Tokei, Z., Dentoni-Litta, E., Horiguchi, N.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)

by Derakhshandeh, J., Beyne, E., Capuz, G., Inoue, F., Cherman, V., De Preter, I., Duval, F., Slabbekoorn, J., Gerets, C., Heyvaert, C., Beirnaert, F., Cochet, T., Bex, P., Hou, L., Lofrano, M., Jamieson, G., Heylen, N., Suhard, S., Honore, M., Webers, T., Bertheau, J., Phommahaxay, A., Van der Plas, G., Rebibis, K. J., Miller, A., Beyer, G.
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)