Sol–gel encapsulation for power electronics utilizing 3-Glycidyloxypropyltriethoxysilane and 3-Mercaptopropyltrimethoxysilane
Kohler, Tobias, Hejtmann, Georg, Henneck, Stefan, Schubert, Martin, Guyenot, Michael
Published in Journal of sol-gel science and technology (01.09.2022)
Published in Journal of sol-gel science and technology (01.09.2022)
Get full text
Journal Article
Ormocer-Primer for Improved Adhesion of Ceramic Composite Encapsulations
Kohler, Tobias, Hejtmann, Georg, Rose, Klaus, Hirth, Erhard, Henneck, Stefan, Hoffmann, M. J.
Published in 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (14.09.2020)
Published in 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (14.09.2020)
Get full text
Conference Proceeding