Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Journal Article
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-il, Yu, Jin, Choi, Won K.
Published in JOM (1989) (01.06.2004)
Published in JOM (1989) (01.06.2004)
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Journal Article
Improving Copper Electrodeposition in the Microelectronics Industry
Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.
Published in IEEE transactions on components and packaging technologies (01.03.2010)
Published in IEEE transactions on components and packaging technologies (01.03.2010)
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Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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Journal Article
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)
Published in Journal of materials research (01.06.2004)
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Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn
Liang Yin, Kondos, P., Borgesen, P., Yihua Liu, Bliznakov, S., Wafula, F., Dimitrov, N., Henderson, D.W., Parks, C., Mao Gao, Therriault, J., Ju Wang, Cotts, E.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)
Published in JOM (1989) (01.06.2003)
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Journal Article
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
Kang, S.K., Lauro, P., Da-Yuan Shih, Henderson, D.W., Gosselin, T., Bartelo, J., Cain, S.R., Goldsmith, C., Puttlitz, K.J., Tae-Kyung Hwang
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Controlling Ag^sub 3^Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
Kang, Sung K, Da-Yuan, Shih, Donovan, Leonard, Henderson, Donald W
Published in JOM (1989) (01.06.2004)
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Published in JOM (1989) (01.06.2004)
Journal Article
Controlling Agsub 3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
Kang, Sung K, Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W
Published in JOM (1989) (01.06.2004)
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Published in JOM (1989) (01.06.2004)
Journal Article
Ag^sub 3^Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K, Choi, Won Kyoung, Da-Yuan, Shih, Henderson, Donald W
Published in JOM (1989) (01.06.2003)
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Published in JOM (1989) (01.06.2003)
Journal Article
Ag 3 Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Journal Article
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
Lu, M., Lauro, P., Da-Yuan Shih, Polastre, R., Goldsmith, C., Henderson, D.W., Hongqing Zhang, Moon Gi Cho
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids
Borgesen, P., Liang Yin, Kondos, P., Henderson, D.W., Servis, G., Ju Wang, Srihari, K.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding