Method of accommodating in volume expansion during solder reflow
Caletka, David Vincent, Darbha, Krishna, Henderson, Donald W, Lehman, Lawrence P, Thiel, George Henry
Year of Publication 08.08.2006
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Year of Publication 08.08.2006
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Method and process for reducing undercooling in a lead-free tin-rich solder alloy
SRIVASTAVA KAMALESH K, HENDERSON DONALD W, HOUGHAM GARETH G, SUNDLOF BRIAN R, KANG SUNG K, FERLITA RICHARD P, DI MILIA DAVID R, SHIH DA-YUAN, CARRUTHERS ROY A, CHEY S. JAY
Year of Publication 31.08.2010
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Year of Publication 31.08.2010
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Method and process for reducing undercooling in a lead-free tin-rich solder alloy
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Year of Publication 31.08.2010
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Year of Publication 31.08.2010
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ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
BROFMAN PETER J, SRIVASTAVA KAMALESH K, HOUGHAM GARETH G, SUNDLOF BRIAN R, SYLVESTRE JULIEN, PERFECTO ERIC D, ARVIN CHARLES L, LIU HSICHANG, SEMKOW KRYSTYNA W, BLANDER ALEXANDRE, HENDERSON DONALD W, REDDY SRINIVASA S.N, WEISMAN RENEE L
Year of Publication 12.08.2010
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Year of Publication 12.08.2010
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METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY
SRIVASTAVA KAMALESH K, HENDERSON DONALD W, HOUGHAM GARETH G, SUNDLOF BRIAN R, KANG SUNG K, FERLITA RICHARD P, DI MILIA DAVID R, SHIH DA-YUAN, CARRUTHERS ROY A, CHEY S. JAY
Year of Publication 24.06.2010
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Year of Publication 24.06.2010
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Method and process for reducing undercooling in a lead-free tin-rich solder alloy
SRIVASTAVA KAMALESH K, HENDERSON DONALD W, HOUGHAM GARETH G, SUNDLOF BRIAN R, KANG SUNG K, FERLITA RICHARD P, DI MILIA DAVID R, SHIH DA-YUAN, CARRUTHERS ROY A, CHEY S. JAY
Year of Publication 27.04.2010
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Year of Publication 27.04.2010
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Method and process for reducing undercooling in a lead-free tin-rich solder alloy
Hougham, Gareth G, Srivastava, Kamalesh K, Kang, Sung K, Shih, Da-Yuan, Sundlof, Brian R, Chey, S. Jay, Henderson, Donald W, Di Milia, David R, Ferlita, Richard P, Carruthers, Roy A
Year of Publication 27.04.2010
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Year of Publication 27.04.2010
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Negative volume expansion lead-free electrical connection
CALETKA, DAVID V, DARBHA, KRISHNA, LEHMAN, LAWRENCE P, THIEL, GEORGE H, HENDERSON, DONALD W
Year of Publication 11.05.2005
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Year of Publication 11.05.2005
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NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
LEHMAN, LAWRENCE, P, THIEL, GEORGE, H, DARBHA, KRISHNA, HENDERSON, DONALD, W, CALETKA, DAVID, V
Year of Publication 12.04.2005
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Year of Publication 12.04.2005
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Lead-free tin-silver-copper alloy solder composition
KANG, SUNG K, GOLDSMITH, CHARLES C, GOSSELIN, TIMOTHY A, CHOI, WON K, HENDERSON, DONALD W
Year of Publication 21.01.2005
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Year of Publication 21.01.2005
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Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
BELANGER LUC, SRIVASTAVA KAMALESH K, SULLIVAN MICHAEL J, GRIFFITH JONATHAN H, SHIH DA-YUAN, LAURO PAUL A, BUCHWALTER STEPHEN L, GIRI AJAY P, HENDERSON DONALD W, LAVOIE CHRISTIAN, KANG SUNG KWON, LAINE ERIC H, OBERSON VALERIE ANNE, BUCHWALTER LEENA PAIVIKKI
Year of Publication 26.04.2011
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Year of Publication 26.04.2011
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Structure to accommodate increase in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 23.09.2004
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Year of Publication 23.09.2004
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Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure
HENDERSON DONALD W, NYE HENRY A.III, KANG SUNG-KWON, KILPATRICK STEPHEN J, SAMBUCETTI CARLOS J, CHIRAS STEFANIE R, SHIH DA-YUAN, CHENG YU-TING
Year of Publication 10.01.2008
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Year of Publication 10.01.2008
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NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
DAVID, V. CALETKA, GEORGE, H. THIEL, DONALD, W. HENDERSON, LAWRENCE, P. LEHMAN, KRISHNA DARBHA
Year of Publication 11.03.2004
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Year of Publication 11.03.2004
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NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
LEHMAN, LAWRENCE, P, THIEL, GEORGE, H, DARBHA, KRISHNA, HENDERSON, DONALD, W, CALETKA, DAVID, V
Year of Publication 04.03.2004
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Year of Publication 04.03.2004
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Structure to accommodate increase in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 03.02.2004
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Year of Publication 03.02.2004
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Structure to accommodate increase in volume expansion during solder reflow
Caletka, David Vincent, Darbha, Krishna, Henderson, Donald W, Lehman, Lawrence P, Thiel, George Henry
Year of Publication 03.02.2004
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Year of Publication 03.02.2004
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