Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
Bernier, William E, Henderson, Donald W, Spalik, James, Paquin, Isabelle
Year of Publication 26.07.2005
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Year of Publication 26.07.2005
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Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
Belanger, Luc, Buchwalter, Stephen L, Buchwalter, Leena Paivikki, Giri, Ajay P, Griffith, Jonathan H, Henderson, Donald W, Kang, Sung Kwon, Laine, Eric H, Lavoie, Christian, Lauro, Paul A, Oberson, Valérie Anne, Shih, Da-Yuan, Srivastava, Kamalesh K, Sullivan, Michael J
Year of Publication 20.11.2012
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Year of Publication 20.11.2012
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MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
NAH JAE-WOONG, SRIVASTAVA KAMALESH, HENDERSON DONALD W, KANG SUNG K, SHIH DA-YUAN, LU MINHUA
Year of Publication 06.08.2009
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Year of Publication 06.08.2009
Patent
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
NAH JAE-WOONG, SRIVASTAVA KAMALESH, HENDERSON DONALD W, KANG SUNG K, SHIH DA-YUAN, LU MINHUA
Year of Publication 06.08.2009
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Year of Publication 06.08.2009
Patent
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
Bernier, William E, Henderson, Donald W, Spalik, James, Paquin, Isabelle
Year of Publication 01.07.2003
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Year of Publication 01.07.2003
Patent
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
BELANGER LUC, SRIVASTAVA KAMALESH K, SULLIVAN MICHAEL J, GRIFFITH JONATHAN H, SHIH DA-YUAN, LAURO PAUL A, BUCHWALTER STEPHEN L, GIRI AJAY P, HENDERSON DONALD W, LAVOIE CHRISTIAN, KANG SUNG KWON, LAINE ERIC H, OBERSON VALERIE ANNE, BUCHWALTER LEENA PAIVIKKI
Year of Publication 20.11.2012
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Year of Publication 20.11.2012
Patent
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
Belanger, Luc, Buchwalter, Stephen L, Buchwalter, Leena Paivikki, Giri, Ajay P, Griffith, Jonathan H, Henderson, Donald W, Kang, Sung Kwon, Laine, Eric H, Lavoie, Christian, Lauro, Paul A, Oberson, Valérie Anne, Shih, Da-Yuan, Srivastava, Kamalesh K, Sullivan, Michael J
Year of Publication 26.04.2011
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Year of Publication 26.04.2011
Patent
Structure to accommodate increase in volume expansion during solder reflow
CALETKA DAVID V, HENDERSON DONALD W, LEHMAN LAWRENCE P, DARBHA KRISHNA, THIEL GEORGE H
Year of Publication 21.09.2006
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Year of Publication 21.09.2006
Patent
Method of accommodating in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 08.08.2006
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Year of Publication 08.08.2006
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