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"HEMBREE, David, R"
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"HEMBREE, David, R"
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스위칭 가능한 라우팅을 위해 구성된 재배선 구조체를 갖는 반도체 디바이스
by
HEMBREE DAVID R
,
JENSEN TRAVIS M
Year of Publication
22.11.2022
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패키징된 반도체 다이에 대한 내열 확산을 위한 장치 및 방법
by
HEMBREE DAVID R
Year of Publication
28.09.2018
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고효율 열 경로 및 몰딩된 언더필을 구비한 적층형 반도체 다이 조립체
by
STEPHENSON WILLIAM R
,
HEMBREE DAVID R
Year of Publication
02.05.2019
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STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCE AND ASSOCIATED SYSTEMS AND METHODS
by
KOOPMANS MICHAEL
,
HEMBREE DAVID R
,
LUO SHIJIAN
Year of Publication
28.09.2016
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STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND ASSOCIATED SYSTEMS
by
GROOTHUIS STEVEN K
,
VADHAVKAR SAMEER S
,
HEMBREE DAVID R
,
LI JIAN
,
DEDDERIAN JAMES M
,
GANDHI JASPREET S
,
LI XIAO
Year of Publication
21.03.2017
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METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS
by
GROOTHUIS STEVEN K
,
VADHAVKAR SAMEER S
,
DERDERIAN JAMES M
,
HEMBREE DAVID R
,
LI JIAN
,
GANDHI JASPREET S
,
LI XIAO
Year of Publication
15.03.2017
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INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STRUCTURES FOR THROUGH-SILICON VIAS
by
FARNWORTH WARREN M
,
FAY OWEN R
,
HEMBREE DAVID R
Year of Publication
19.05.2011
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Apparatuses and methods for internal heat spreading for packaged semiconductor die
by
Hembree
,
David R
Year of Publication
10.05.2022
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STACKED SEMICONDUCTOR DIE ASSEMBLY WITH A THERMALLY CONDUCTIVE CASING AND A METHOD OF MANUFACTURING SUCH AN ASSEMBLY
by
KOOPMANS, Michael
,
HEMBREE
,
David
,
R
,
LUO, Shijian
Year of Publication
01.05.2024
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SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING
by
Hembree
,
David R
,
Jensen, Travis M
Year of Publication
15.02.2024
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Semiconductor devices with redistribution structures configured for switchable routing
by
Hembree
,
David R
,
Jensen, Travis M
Year of Publication
17.10.2023
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SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING
by
JENSEN, Travis, M
,
HEMBREE
,
David
,
R
Year of Publication
08.02.2023
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APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SEMICONDUCTOR DIE
by
HEMBREE
,
David R
Year of Publication
23.10.2019
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SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE INTERCONNECTS
by
HEMBREE
,
David R
Year of Publication
11.09.2019
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STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND MOLDED UNDERFILL
by
Stephenson, William R
,
Hembree
,
David R
Year of Publication
19.05.2022
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APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SEMICONDUCTOR DIE
by
HEMBREE
,
David R
Year of Publication
26.12.2018
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SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE INTERCONNECTS
by
HEMBREE
,
David R
Year of Publication
05.12.2018
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SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING
by
Hembree
,
David R
,
Jensen, Travis M
Year of Publication
24.02.2022
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Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
by
Stephenson, William R
,
Hembree
,
David R
Year of Publication
01.02.2022
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Apparatuses and methods for heat transfer from packaged semiconductor die
by
Hembree
,
David R
Year of Publication
04.09.2018
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