Production of semiconductor wafer comprises simultaneously polishing the front and rear sides of wafer between rotating polishing plates using an alkaline polishing sol and then an alcohol, cleaning, drying and applying an epitaxial layer
SIEBERT, WOLFGANG, WENSKI, GUIDO, ALTMANN, THOMAS, MESMANN, KLAUS, FUERFANGER, MARTIN, HEIER, GERHARD
Year of Publication 15.02.2001
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Year of Publication 15.02.2001
Patent
Verfahren zur Herstellung einer Halbleiterscheibe mit verbesserter Ebenheit
FEUCHTINGER, ERNST, WENSKI, GUIDO, ALTMANN, THOMAS, WINKLER, WOLFGANG, HEIER, GERHARD, BERNWINKLER, WILLI
Year of Publication 14.12.2000
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Year of Publication 14.12.2000
Patent
New double-sided polished semiconductor wafer has extremely low front face site front surface-referenced least squares ratio planarity values varying insignificantly between the wafer edge and central regions
FEUCHTINGER, ERNST, WENSKI, GUIDO, ALTMANN, THOMAS, WINKLER, WOLFGANG, HEIER, GERHARD, BERNWINKLER, WILLI
Year of Publication 31.08.2000
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Year of Publication 31.08.2000
Patent