Low k dielectric materials with inherent copper ion migration barrier
HEDRICK JEFFREY CURTIS, SHAW JANE MARGARET, COHEN STEPHAN ALAN, FEGER CLAUDIUS
Year of Publication 02.07.2002
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Year of Publication 02.07.2002
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Low k dielectric materials with inherent copper ion migration barrier
COHEN, STEPHAN ALAN, FEGER, CLAUDIUS, HEDRICK, JEFFREY CURTIS, SHAW, JANE MARGARET
Year of Publication 01.07.2002
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Year of Publication 01.07.2002
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LOW K DIELECTRIC MATERIALS WITH INHERENT COPPER ION MIGRATION BARRIER
HEDRICK JEFFREY CURTIS, SHAW JANE MARGARET, COHEN STEPHAN ALAN, FEGER CLAUDIUS
Year of Publication 21.03.2002
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Year of Publication 21.03.2002
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LOW K DIELECTRIC MATERIALS WITH INHERENT COPPER ION MIGRATION BARRIER
COHEN, STEPHAN ALAN, FEGER, CLAUDIUS, HEDRICK, JEFFREY CURTIS, SHAW, JANE MARGARET
Year of Publication 21.03.2002
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Year of Publication 21.03.2002
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METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 25.02.2004
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Year of Publication 25.02.2004
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METHOD OF FABRICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY
HEDRICK, JEFFREY, CURTIS, ECKERT, ANDREW, ROBERT, HAY, JOHN, C, LEE, KANG-WOOK, SIMONYI, EVA, ERIKA, LINIGER, ERIC, GERHARD
Year of Publication 18.12.2003
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Year of Publication 18.12.2003
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DIELECTRIC MATERIAL OF LOW PERMITTIVITY COMPRISING INTRINSIC COPPER ION MIGRATION BARRIER
STEPHAN ALAN COEN, HEDRICK JEFFREY CURTIS, CLADIUS FEEGAA, SHAW JANE MARGARET
Year of Publication 30.03.2001
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Year of Publication 30.03.2001
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Method for forming a porous dielectric material layer in a semiconductor device and device formed
HEDRICK JEFFREY CURTIS, RODBELL KENNETH PARKER, ROSENBERG ROBERT, DALTON TIMOTHY JOSEPH, NITTA SATYANARAYANA V, GRECO STEPHEN EDWARD, PURUSHOTHAMAN SAMPATH
Year of Publication 27.03.2003
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Year of Publication 27.03.2003
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WATER-BASED THERMOSETTING RESIN EMULSIONS FOR ELECTRONIC DEVICES
TISDALE, STEPHEN LEO, LEWIS, DAVID ANDREW, VIEHBECK, ALFRED, HEDRICK, JEFFREY CURTIS, WHITEHAIR, STANLEY J, PAPATHOMAS, KOSTAS
Year of Publication 02.10.2000
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Year of Publication 02.10.2000
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Multilayer interconnect structure containing air gaps and method for making
CARRUTHERS ROY ARTHUR, HEDRICK JEFFREY CURTIS, SAENGER KATHERINE LYNN, BABICH KATHERINA E, JAHNES CHRISTOPHER VINCENT, MAYS EBONY LYNN, DALTON TIMOTHY JOSEPH, GRILL ALFRED, PERRAUD LAURENT, PURUSHOTHAMAN SAMPATH
Year of Publication 17.02.2005
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Year of Publication 17.02.2005
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Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA, HEDRICK JEFFREY CURTIS, LEE KANG-WOOK, LINIGER ERIC GERHARD, ECKERT ANDREW ROBERT, HAY JOHN C
Year of Publication 31.10.2002
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Year of Publication 31.10.2002
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Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density
SIMONYI EVA ERIKA, HEDRICK JEFFREY CURTIS, LEE KANG-WOOK, LINIGER ERIC GERHARD, ECKERT ANDREW ROBERT, HAY JOHN C
Year of Publication 24.09.2002
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Year of Publication 24.09.2002
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