Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
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Year of Publication 05.10.2010
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Year of Publication 05.10.2010
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Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
GRINMAN ANDREY, AKSENTON YULIA, HECHT ILYA, ROSENSTEIN CHARLES, DAYAN AVI, HAZANOVICH FELIX, OVRUTSKY DAVID, OGANESIAN VAGE
Year of Publication 05.10.2010
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Year of Publication 05.10.2010
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Year of Publication 03.05.2011
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Year of Publication 03.05.2011
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Wafer level chip packaging
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Year of Publication 03.05.2011
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Year of Publication 03.05.2011
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Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
GRINMAN ANDREY, AKSENTON YULIA, HECHT ILYA, ROSENSTEIN CHARLES, DAYAN AVI, HAZANOVICH FELIX, OVRUTSKY DAVID, OGANESIAN VAGE
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Year of Publication 01.05.2008
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WAFER LEVEL CHIP PACKAGING
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Year of Publication 03.01.2008
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WAFER LEVEL PACKAGING TO LIDDED CHIPS
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Year of Publication 27.12.2007
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Year of Publication 27.12.2007
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Wafer level chip packaging
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Year of Publication 16.08.2007
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Year of Publication 16.08.2007
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Wafer level packaging to lidded chips
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Year of Publication 16.08.2007
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Year of Publication 16.08.2007
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WAFER LEVEL PACKAGING TO LIDDED CHIPS
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Year of Publication 02.08.2007
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Year of Publication 02.08.2007
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WAFER LEVEL CHIP PACKAGING
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Year of Publication 02.08.2007
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Year of Publication 02.08.2007
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Wafer level packaging to lidded chips
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Year of Publication 21.02.2013
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Wafer level chip packaging
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Year of Publication 11.08.2011
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Wafer level chip packaging
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Year of Publication 16.10.2007
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Year of Publication 16.10.2007
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