The preparation and properties of high thermal conductive epoxy composites modified by boron nitride and alumina complex micron fillers
Wang, Kun, Yang, Wei, Chen, Yun, Zhang, Chong, He, Jinfeng, Bian, Kai, Chen, Xin
Published in 2021 3rd International Academic Exchange Conference on Science and Technology Innovation (IAECST) (10.12.2021)
Published in 2021 3rd International Academic Exchange Conference on Science and Technology Innovation (IAECST) (10.12.2021)
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Conference Proceeding
The step curing method decided by curing kinetics equation and isothermal viscosity curve for electrical epoxy packaging materials
Wang, Kun, Yang, Wei, Chen, Yun, Zhang, Chong, Yin, Li, Chen, Xin, He, Jinfeng, Yan, Bingyue, He, Yu
Published in 2021 3rd International Symposium on Robotics & Intelligent Manufacturing Technology (ISRIMT) (24.09.2021)
Published in 2021 3rd International Symposium on Robotics & Intelligent Manufacturing Technology (ISRIMT) (24.09.2021)
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Conference Proceeding