Search Results - "HE BISHAN" :: K.UTB vyhledávací portál

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology

by Batra, Pooja, Skordas, Spyridon, LaTulipe, Douglas, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John
Published in Journal of low power electronics and applications (05.05.2014)

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Nintedanib Effect in Osimertinib-Induced Interstitial Pneumonia

by Fang, Wenfeng, Huang, Yihua, Gan, Jiadi, He, Bishan, Zhang, Li
Published in Journal of thoracic oncology (01.03.2020)

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Journal Article

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Three-dimensional wafer stacking using Cu TSV integrated with 45nm high performance SOI-CMOS embedded DRAM technology

by Batra, Pooja, LaTulipe, Douglas, Skordas, Spyridon, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John, Wei Lin, Tuan Vo, Priyadarshini, Deepika, Hubbard, Alex, Cauffman, Kristian, Peethala, Brown, Barth, John, Kirihata, Toshiaki, Graves-Abe, Troy, Robson, Norman, Iyer, Subramanian
Published in 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2013)

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Conference Proceeding

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3D stackable 32nm High-K/Metal Gate SOI embedded DRAM prototype

by Golz, J., Safran, J., Bishan He, Leu, D., Ming Yin, Weaver, T., Vehabovic, A., Yan Sun, Cestero, A., Himmel, B., Maier, G., Kothandaraman, C., Fainstein, D., Barth, J., Robson, N., Kirihata, T., Ken Rim, Iyer, S.
Published in 2011 Symposium on VLSI Circuits - Digest of Technical Papers (01.06.2011)

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Conference Proceeding