Electromigration characterization of lead-free flip-chip bumps for 45nm technology node
Hau-Riege, C, You-Wen Yau, Yu, Nick
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
랜드 그리드 기반 다중 크기 패드 패키지
ZHANG XIAONAN, LI YUE, XU HAIYONG, ZANG RUEY KAE, HAU RIEGE CHRISTINE, KAKADE MANOJ
Year of Publication 17.04.2019
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Year of Publication 17.04.2019
Patent
Key metrics for the electromigration performance for solder and copper-based package interconnects
Hau-Riege, Christine, YouWen Yau, Caffey, Kevin
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)
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Conference Proceeding
A study of self- and mutual-heating in wafer level packaging systems
Hau-Riege, Christine, Guoping Xu, Zhang, Q. J., YouWen Yau, Farr, Hosain
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding
Electromigration Reliability of Solder Balls
Hau-Riege, Christine, Yau, YouWen
Published in 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2018)
Published in 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2018)
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Conference Proceeding
Electromigration of Gold Metallization
Hau-Riege, Christine, Yau, YouWen
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.09.2021)
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.09.2021)
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Conference Proceeding
Current Challenges in Cu Electromigration Reliability
Hau-Riege, Christine
Published in 2006 IEEE International Integrated Reliability Workshop Final Report (01.10.2006)
Published in 2006 IEEE International Integrated Reliability Workshop Final Report (01.10.2006)
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Conference Proceeding
The electromigration behavior of copper pillars for different current directions and pillar shapes
Hau-Riege, Christine, YouWen Yau, Caffey, Kevin, Kumar, Rajneesh, YangYang Sun, Bao, Andy, Shah, Milind, Zhao, Lily, Bchir, Omar, Syed, Ahmer, Bezuk, Steve
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
The effect of a width transition on the electromigration reliability of Cu interconnects
Hau-Riege, C., Klein, R.
Published in 2008 IEEE International Reliability Physics Symposium (01.04.2008)
Published in 2008 IEEE International Reliability Physics Symposium (01.04.2008)
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Conference Proceeding
The impact of 45 to 28nm node-scaling on the electromigration of flip-chip bumps
Hau-Riege, C., You-Wen Yau, Zhao, L.
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
The effect of current direction on the electromigration in short-lines with reservoirs
Hau-Riege, C.S., Marathe, A.P., Zung-Sun Choi
Published in 2008 IEEE International Reliability Physics Symposium (01.04.2008)
Published in 2008 IEEE International Reliability Physics Symposium (01.04.2008)
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Conference Proceeding
Layout construction for addressing electromigration
Balasubramanian, Prathiba, Kwon, Ohsang, Hau-Riege, Christine Sung-An, Bomshtein, Nikolay, Brunolli, Michael Joseph, Malabry, Mickael, Rasouli, Seid Hadi, Harish, Sucheta Kumar, Medisetti, Kamesh, Datta, Animesh
Year of Publication 22.11.2022
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Year of Publication 22.11.2022
Patent
A statistical method for the characterization of bimodal electromigration distributions
Hau-Riege, C., EunJoo Lee, Thierbach, S., Marathe, A., Kittler, R.
Published in 2007 International Symposium on Semiconductor Manufacturing (01.10.2007)
Published in 2007 International Symposium on Semiconductor Manufacturing (01.10.2007)
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Conference Proceeding
The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging
Hau-Riege, Christine, Keser, Beth, Alvarado, Rey, Syed, Ahmer, Yau, YouWen, Bezuk, Steve, Caffey, Kevin
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Land grid based multi size pad package
Xu, Haiyong, Zang, Ruey Kae, Zhang, Xiaonan, Kakade, Manoj, Li, Yue, Hau-Riege, Christine
Year of Publication 31.01.2019
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Year of Publication 31.01.2019
Patent
Electromigration of solder balls for wafer-level packaging with different under bump metallurgy and redistribution layer thickness
Hau-Riege, Christine, Keser, Beth, You-Wen Yau, Bezuk, Steve
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
LAND GRID BASED MULTI SIZE PAD PACKAGE
XU, Haiyong, LI, Yue, HAU-RIEGE, Christine, ZANG, Ruey Kae, ZHANG, Xiaonan, KAKADE, Manoj
Year of Publication 26.06.2019
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Year of Publication 26.06.2019
Patent
LAYOUT CONSTRUCTION FOR ADDRESSING ELECTROMIGRATION
BALASUBRAMANIAN, Prathiba, MEDISETTI, Kamesh, HAU-RIEGE, Christine Sung-An, MALABRY, Mickael, RASOULI, Seid Hadi, BOMSHTEIN, Nikolay, BRUNOLLI, Michael Joseph, KWON, Ohsang, DATTA, Animesh, HARISH, Sucheta Kumar
Year of Publication 28.05.2020
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Year of Publication 28.05.2020
Patent
Layout construction for addressing electromigration
Balasubramanian, Prathiba, Kwon, Ohsang, Hau-Riege, Christine Sung-An, Bomshtein, Nikolay, Brunolli, Michael Joseph, Malabry, Mickael, Rasouli, Seid Hadi, Harish, Sucheta Kumar, Medisetti, Kamesh, Datta, Animesh
Year of Publication 24.03.2020
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Year of Publication 24.03.2020
Patent