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Improvements in or relating to semiconductor device packaging
by
JARMAN, HALL E
,
STEARNS, WILLIAM P
,
HASSANTADEH
,
NOZAR
Year of Publication
05.04.2000
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SEMICONDUCTOR PACKAGE HAVING OFFSET DIE PAD AND ITS MANUFACTURE
by
HASSANTADEH NOZAR
,
JARMAN HALL E
,
STEARNS WILLIAM P
Year of Publication
25.09.1998
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Improvements in or relating to semiconductor device packaging
by
JARMAN, HALL E
,
STEARNS, WILLIAM P
,
HASSANTADEH
,
NOZAR
Year of Publication
22.07.1998
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chemistry
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basic electric elements
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electric solid state devices not otherwise provided for
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semiconductor devices
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esp@cenet
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