Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds
Zulkifli, Muhammad Nubli, Harun, Fuaida, Jalar, Azman
Published in Microelectronics international (21.05.2019)
Published in Microelectronics international (21.05.2019)
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Journal Article
Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds
Zulkifli, Muhammad Nubli, Jalar, Azman, Harun, Fuaida
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2019)
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Journal Article
An Improvement of Plasma Cleaning Time towards Leadframe Oxidation Performance
Amri, MS, Rashid, Wan Norhisyam Abd, Harun, Fuaida, Kadmin, A.F, Basar, M.F., Rahman, K.A, A.
Published in Journal of physics. Conference series (01.04.2020)
Published in Journal of physics. Conference series (01.04.2020)
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Journal Article
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques
Amri, Mohd Syahrin, Omar, Ghazali, Mispan, Mohd Syafiq, Harun, Fuaida, Othman, MNB, Ngatiman, N.A., Ibrahim, Masrullizam Mat
Published in IEEE transactions on semiconductor manufacturing (27.07.2024)
Published in IEEE transactions on semiconductor manufacturing (27.07.2024)
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Journal Article
Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond
Abdullah, Shahrum, Harun, Fuaida, Ismail, Roslina, Jalar, Azman
Published in Materials Science Forum (01.05.2016)
Published in Materials Science Forum (01.05.2016)
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Journal Article
Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond
Abdullah, Shahrum, Harun, Fuaida, Ismail, Roslina, Jalar, Azman
Published in Materials Science Forum (01.05.2016)
Published in Materials Science Forum (01.05.2016)
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Journal Article
Effect of wire diameter and hook location on second bond failure modes
Harun, Fuaida, Ismail, Roslina, Jalar, Azman, Abdullah, Shahrum
Published in Microelectronics international (05.01.2015)
Published in Microelectronics international (05.01.2015)
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Journal Article
Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium-Gold-Silver Metallization
Ismail, Roslina, Harun, Fuaida, Zulkifli, Muhammad Nubli, Jalar, Azman, Abu Bakar, Maria, Abdullah, Shahrum
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2015)
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Journal Article
Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process
Amri, Mohd Syahrin, Liew, David, Harun, Fuaida
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Challenges in copper 2nd bond quality on nickel palladium leadframe
Tan Kian Heong, Harun, Fuaida
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Solving eventual bonding quality to enhance adhesion for QFN packages
Kumar, S, Sivarao, S, Cheong, M T, Azmeer, M, Fuaida, H
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding