by Rimolo-Donadio, Renato, Supper, J., Winkel, T., Harrer, H., Schuster, C.
Published in IEEE transactions on electromagnetic compatibility (01.04.2012)

by Geva, Ofer, Berry, Chris, Sonnelitter, Robert, Wolpert, David, Collura, Adam, Strach, Thomas, Phan, Di, Lichtenau, Cedric, Buyuktosunoglu, Alper, Harrer, Hubert, Zitz, Jeffrey, Marquart, Chad, Malone, Douglas, Webel, Tobias, Jatkowski, Adam, Isakson, John, Hamid, Dina, Cichanowski, Mark, Romain, Michael, Hasan, Faisal, Williams, Kevin, Surprise, Jesse, Cavitt, Chris, Cohen, Mark
Published in 2022 IEEE International Solid- State Circuits Conference (ISSCC) (20.02.2022)

by Warnock, James, Yuen Chan, Harrer, Hubert, Carey, Sean, Salem, Gerard, Malone, Doug, Puri, Ruchir, Zitz, Jeffrey A., Jatkowski, Adam, Strevig, Gerald, Datta, Ayan, Gattiker, Anne, Bansal, Aditya, Mayer, Guenter, Yiu-Hing Chan, Mayo, Mark, Rude, David L., Sigal, Leon, Strach, Thomas, Smith, Howard H., Huajun Wen, Pak-kin Mak, Shum, C-L Kevin, Plass, Donald, Webb, Charles
Published in IEEE journal of solid-state circuits (01.01.2014)

by FISCHER ERICH, NAUMANN MICHAEL, REGAHL THOMAS, HARRER HUBERT, PAFUMI FABIO, MECKLER PETER
Year of Publication 18.10.2017

by Selezinski, Nicole, Duan, Xiaomin, Scharff, Katharina, Kaller, Dierk, Harrer, Hubert
Published in 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) (07.05.2023)

by SCHMIDT WOLFGANG, HARRER HUBERT, WERNER KLAUS, WEBER WALDEMAR
Year of Publication 21.01.2014

by Scharff, Katharina, Duan, Xiaomin, Cocchini, Matteo, Nguyen, Hung, Selezinski, Nicole, Kaller, Dierk, Harrer, Hubert
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)

by Katopis, G.A., Becker, W.D., Harrer, H.H.
Published in IEEE transactions on advanced packaging (01.02.2005)

by Warnock, J., Chan, Y. H., Harrer, H., Rude, D., Puri, R., Carey, S., Salem, G., Mayer, G., Yiu-Hing Chan, Mayo, M., Jatkowski, A., Strevig, G., Sigal, L., Datta, A., Gattiker, A., Bansal, A., Malone, D., Strach, T., Huajun Wen, Pak-Kin Mak, Chung-Lung Shum, Plass, D., Webb, C.
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)

by Werner, Klaus, Loos, Klaus, Harrer, Hubert, Zeberl, Juergen, Koepf, Hendrik-Christian
Year of Publication 14.05.2024

by HARRER, Hubert, LOOS, Klaus, WERNER, Klaus, LATHAM, Dean, PAFUMI, Fabio, ZEBERL, Juergen, FISCHER, Erich
Year of Publication 17.04.2024

by HARRER, Hubert, LOOS, Klaus, WERNER, Klaus, LATHAM, Dean, PAFUMI, Fabio, ZEBERL, Juergen, FISCHER, Erich
Year of Publication 17.04.2024

by Winkel, T-M, Harrer, H, Kaller, D, Supper, J, Dreps, D M, Christian, K L, Cosmadelis, D, Zhou, T, Strach, T, Ludwig, J, Edwards, D L
Published in IBM journal of research and development (01.01.2009)

by Werner, Klaus, Loos, Klaus, Harrer, Hubert, Zeberl, Juergen, Koepf, Hendrik-Christian
Year of Publication 14.11.2023

by Wagner, Grant, Chun, Sungjun, Harrer, Hubert, Grady, Matthew Sean, Kumar, Arvind, Wassick, Thomas Anthony, Ostrander, Steven Paul, Audette, David Michael
Year of Publication 27.06.2024

by Harrer, H., Dreps, D. M., Winkel, T.-M., Scholz, W., Truong, B. G., Huber, A., Zhou, T., Christian, K. L., Goth, G. F.
Published in IBM journal of research and development (01.01.2007)

by Fischer, Erich, Werner, Klaus, Pafumi, Fabio, Loos, Klaus, Harrer, Hubert, Latham, Dean, Zeberl, Juergen
Year of Publication 27.12.2022

by HUBERT HARRER
Year of Publication 03.11.2011

by HARRER, HUBERT
Year of Publication 27.09.2011

by KOPF, HENDRIKRISTIAN, ZEBERL, JURGEN, LOOS, KLAUS, WERNER, KLAUS, HARRER, HUBERT
Year of Publication 07.01.2021