IBM Telum: a 16-Core 5+ GHz DCM
Geva, Ofer, Berry, Chris, Sonnelitter, Robert, Wolpert, David, Collura, Adam, Strach, Thomas, Phan, Di, Lichtenau, Cedric, Buyuktosunoglu, Alper, Harrer, Hubert, Zitz, Jeffrey, Marquart, Chad, Malone, Douglas, Webel, Tobias, Jatkowski, Adam, Isakson, John, Hamid, Dina, Cichanowski, Mark, Romain, Michael, Hasan, Faisal, Williams, Kevin, Surprise, Jesse, Cavitt, Chris, Cohen, Mark
Published in 2022 IEEE International Solid- State Circuits Conference (ISSCC) (20.02.2022)
Published in 2022 IEEE International Solid- State Circuits Conference (ISSCC) (20.02.2022)
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Conference Proceeding
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module
Warnock, James, Yuen Chan, Harrer, Hubert, Carey, Sean, Salem, Gerard, Malone, Doug, Puri, Ruchir, Zitz, Jeffrey A., Jatkowski, Adam, Strevig, Gerald, Datta, Ayan, Gattiker, Anne, Bansal, Aditya, Mayer, Guenter, Yiu-Hing Chan, Mayo, Mark, Rude, David L., Sigal, Leon, Strach, Thomas, Smith, Howard H., Huajun Wen, Pak-kin Mak, Shum, C-L Kevin, Plass, Donald, Webb, Charles
Published in IEEE journal of solid-state circuits (01.01.2014)
Published in IEEE journal of solid-state circuits (01.01.2014)
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Journal Article
회로 차단기 및 그 동작 방법
FISCHER ERICH, NAUMANN MICHAEL, REGAHL THOMAS, HARRER HUBERT, PAFUMI FABIO, MECKLER PETER
Year of Publication 18.10.2017
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Year of Publication 18.10.2017
Patent
Routing Length Impact on Differential Via Crosstalk Cancellation
Selezinski, Nicole, Duan, Xiaomin, Scharff, Katharina, Kaller, Dierk, Harrer, Hubert
Published in 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) (07.05.2023)
Published in 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) (07.05.2023)
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Conference Proceeding
Hardware Verification of Via Crosstalk Cancellation for Differential BGA-to-BGA Links
Scharff, Katharina, Duan, Xiaomin, Cocchini, Matteo, Nguyen, Hung, Selezinski, Nicole, Kaller, Dierk, Harrer, Hubert
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
Published in 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (09.10.2022)
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Conference Proceeding
T-Rex, a blade packaging architecture for mainframe servers
Katopis, G.A., Becker, W.D., Harrer, H.H.
Published in IEEE transactions on advanced packaging (01.02.2005)
Published in IEEE transactions on advanced packaging (01.02.2005)
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Journal Article
Conference Proceeding
5.5GHz system z microprocessor and multi-chip module
Warnock, J., Chan, Y. H., Harrer, H., Rude, D., Puri, R., Carey, S., Salem, G., Mayer, G., Yiu-Hing Chan, Mayo, M., Jatkowski, A., Strevig, G., Sigal, L., Datta, A., Gattiker, A., Bansal, A., Malone, D., Strach, T., Huajun Wen, Pak-Kin Mak, Chung-Lung Shum, Plass, D., Webb, C.
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)
Published in 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (01.02.2013)
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Conference Proceeding
Circuit breaker
Werner, Klaus, Loos, Klaus, Harrer, Hubert, Zeberl, Juergen, Koepf, Hendrik-Christian
Year of Publication 14.05.2024
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Year of Publication 14.05.2024
Patent
CIRCUIT BREAKER HOUSING
HARRER, Hubert, LOOS, Klaus, WERNER, Klaus, LATHAM, Dean, PAFUMI, Fabio, ZEBERL, Juergen, FISCHER, Erich
Year of Publication 17.04.2024
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Year of Publication 17.04.2024
Patent
CIRCUIT BREAKER HOUSING
HARRER, Hubert, LOOS, Klaus, WERNER, Klaus, LATHAM, Dean, PAFUMI, Fabio, ZEBERL, Juergen, FISCHER, Erich
Year of Publication 17.04.2024
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Year of Publication 17.04.2024
Patent
Packaging design challenges of the IBM System z10 Enterprise Class server
Winkel, T-M, Harrer, H, Kaller, D, Supper, J, Dreps, D M, Christian, K L, Cosmadelis, D, Zhou, T, Strach, T, Ludwig, J, Edwards, D L
Published in IBM journal of research and development (01.01.2009)
Published in IBM journal of research and development (01.01.2009)
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Journal Article
Electrical switching system
Werner, Klaus, Loos, Klaus, Harrer, Hubert, Zeberl, Juergen, Koepf, Hendrik-Christian
Year of Publication 14.11.2023
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Year of Publication 14.11.2023
Patent
CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST
Wagner, Grant, Chun, Sungjun, Harrer, Hubert, Grady, Matthew Sean, Kumar, Arvind, Wassick, Thomas Anthony, Ostrander, Steven Paul, Audette, David Michael
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
High-speed interconnect and packaging design of the IBM System z9 processor cage
Harrer, H., Dreps, D. M., Winkel, T.-M., Scholz, W., Truong, B. G., Huber, A., Zhou, T., Christian, K. L., Goth, G. F.
Published in IBM journal of research and development (01.01.2007)
Published in IBM journal of research and development (01.01.2007)
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Journal Article
Circuit breaker housing
Fischer, Erich, Werner, Klaus, Pafumi, Fabio, Loos, Klaus, Harrer, Hubert, Latham, Dean, Zeberl, Juergen
Year of Publication 27.12.2022
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Year of Publication 27.12.2022
Patent
ELECTRICAL SWITCHING SYSTEM
KOPF, HENDRIKRISTIAN, ZEBERL, JURGEN, LOOS, KLAUS, WERNER, KLAUS, HARRER, HUBERT
Year of Publication 07.01.2021
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Year of Publication 07.01.2021
Patent