Optimized semiconductor packaging in a three-dimensional stack
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Year of Publication 28.08.2012
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Year of Publication 28.08.2012
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Optimized semiconductor packaging in a three-dimensional stack
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Year of Publication 28.08.2012
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Year of Publication 28.08.2012
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Optimized semiconductor packaging in a three-dimensional stack
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Year of Publication 31.07.2013
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OPTIMIZED SEMICONDUCTOR PACKAGING IN A THREE-DIMENSIONAL STACK
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Year of Publication 03.05.2012
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Year of Publication 03.05.2012
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OPTIMIZED SEMICONDUCTOR PACKAGING IN A THREE-DIMENSIONAL STACK
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Year of Publication 03.05.2012
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Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits
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Year of Publication 03.05.2012
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Year of Publication 03.05.2012
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HEAT SINK INTEGRATED POWER DELIVERY AND DISTRIBUTION FOR INTEGRATED CIRCUITS
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Year of Publication 03.05.2012
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Thermal Power Plane for Integrated Circuits
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Year of Publication 03.05.2012
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Year of Publication 03.05.2012
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THERMAL POWER PLANE FOR INTEGRATED CIRCUITS
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Year of Publication 03.05.2012
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Year of Publication 03.05.2012
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Optimized Semiconductor Packaging in a Three-Dimensional Stack
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Year of Publication 03.05.2012
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Year of Publication 03.05.2012
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Fast parametric pre-layout analysis of signal integrity for backplane interconnects
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Published in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) (01.05.2011)
Published in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) (01.05.2011)
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Year of Publication 12.08.2014
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TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY
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Year of Publication 03.04.2014
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Circuit breaker and method for operation thereof
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Year of Publication 13.07.2017
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In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen sowie 3-D-VLSI-Einheit, Datenverarbeitungssystem und Verfahren damit
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Year of Publication 03.11.2016
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