Microchannel size effects on local flow boiling heat transfer to a dielectric fluid
Harirchian, Tannaz, Garimella, Suresh V.
Published in International journal of heat and mass transfer (15.07.2008)
Published in International journal of heat and mass transfer (15.07.2008)
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Journal Article
The critical role of channel cross-sectional area in microchannel flow boiling heat transfer
Harirchian, Tannaz, Garimella, Suresh V.
Published in International journal of multiphase flow (01.10.2009)
Published in International journal of multiphase flow (01.10.2009)
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Journal Article
열 관리를 위한 에너지 저장 재료 및 관련 기술들과 구성들
LOFGREEN KELLY P, MATAYABAS JR. JAMES C, HARIRCHIAN TANNAZ, KRAJNIAK JAN, RARAVIKAR NACHIKET R, SANKMAN ROBERT L
Year of Publication 28.11.2017
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Year of Publication 28.11.2017
Patent
Flow Boiling in Silicon Microchannel Heat Sinks
Harirchian, T., Garimella, S.V.
Published in 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2008)
Published in 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2008)
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Conference Proceeding
Thermally-optimized tunable stack in cavity package-on-package
McCann, Aaron, Harirchian, Tannaz, Uppal, Aastha, Cetegen, Edvin, Vakanas, George, Jayaraman, Saikumar, Elhalawaty, Shereen
Year of Publication 26.09.2023
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Year of Publication 26.09.2023
Patent
THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE
ELHALAWATY, Shereen, CETEGEN, Edvin, MCCANN, Aaron, UPPAL, Aastha, HARIRCHIAN, Tannaz, JAYARAMAN, Saikumar, VAKANAS, George
Year of Publication 06.02.2020
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Year of Publication 06.02.2020
Patent
Thermal management of molded packages
Harirchian, Tannaz, Eid, Feras, Abazarnia, Nader N, Liff, Shawna M, Oster, Sasha N, Beasley, Taesha D, Swan, Johanna M
Year of Publication 24.09.2019
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Year of Publication 24.09.2019
Patent
Event-based use conditions method for thermo-mechanical reliability risk assessment
Sauciuc, Ioan, Goyal, Sanjay, Min Pei, Harirchian, Tannaz, Tse, Maritza, Kwasnick, Robert, Tripathi, Shantanu, Matusevich, Alena
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
Contact Pressure and Load Measurement Techniques for Applications in Semiconductor Packaging
Yagnamurthy, Sivakumar, Klein, Steven, Haehn, Nicholas, Reynolds, Seth, Harirchian, Tannaz, Chia-Pin Chiu, Devasenathipathy, Shankar, Malatkar, Pramod, Haowen Liu, Shaw Fong Wong
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Thermal-mechanical considerations during thermal solution assembly of bare-die packages
Je-Young Chang, Harirchian, Tannaz, Sahasrabudhe, Shubhada, Klein, Steve, Liang, Frank, Haowen Liu, Weng, Moss, Gallina, Mark, Cartas-Ayala, Marco A., Muddu, Radha, Gupta, Ashish
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Thermal Management of Molded Packages
Harirchian, Tannaz, Eid, Feras, Abazarnia, Nader N, Liff, Shawna M, Oster, Sasha N, Beasley, Taesha D, Swan, Johanna M
Year of Publication 28.06.2018
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Year of Publication 28.06.2018
Patent