by Wang, S., Albrecht, B., Harendt, C., Schulze Spuntrup, J. D., Burghartz, J. N.
Published in 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) (20.06.2021)

by Wang, S., Spuntrup, J. D. Schulze, Albrecht, B., Harendt, C., Burghartz, J. N.
Published in 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) (10.07.2022)

by Passlack, U., Albrecht, B., Harendt, C., Burghartz, J.N.
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)

by Arena, A, Boulougoura, M, Chowdrey, H S, Dario, P, Harendt, C, Irion, K-M, Kodogiannis, V, Lenaerts, B, Menciassi, A, Puers, R, Scherjon, C, Turgis, D
Published in Studies in health technology and informatics (2005)

by Harendt, C, Graf, H G, Hofflinger, B, Penteker, E
Published in Journal of micromechanics and microengineering (01.09.1992)

by Harendt, C., Goschnick, J., Hirschwald, W.
Published in Surface science (01.01.1985)

by Endler, S., Ferwana, S., Rempp, H., Harendt, C., Burghartz, J. N.
Published in IEEE electron device letters (01.03.2012)

by Alshahed, M., Alomari, M., Harendt, C., Burghartz, J. N., Wachter, C., Bergunde, T., Lutgen, S.
Published in 2016 46th European Solid-State Device Research Conference (ESSDERC) (01.09.2016)

by Apel, U., Graf, H.G., Harendt, C., Hofflinger, B., Ifstrom, T.
Published in IEEE transactions on electron devices (01.07.1991)

by Harendt, C, Appel, W, Graf, H -G, Hofflinger, B, Penteker, E
Published in Journal of micromechanics and microengineering (01.09.1991)

by Harendt, C., Christmann, K., Hirschwald, W., Vickerman, J.C.
Published in Surface science (01.01.1986)

by Ifstrom, T., Apel, U., Graf, H.-G., Harendt, C., Hofflinger, B.
Published in IEEE electron device letters (01.09.1992)

by Ifström, T., Apel, U., Graf, H.-G., Harendt, C., Höfflinger, B.
Published in Microelectronic engineering (1992)

by Sakakini, B., Dunhill, N., Harendt, C., Steeples, B., Vickerman, J.C.
Published in Surface science (01.10.1987)

by Burghartz, J.N., Appel, W., Harendt, C., Rempp, H., Richter, H., Zimmermann, M.
Published in 2009 Proceedings of the European Solid State Device Research Conference (01.09.2009)

by Endler, S., Rempp, H., Harendt, C., Burghartz, J. N.
Published in 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2011)

by Burghartz, J.N., Harendt, C., Tu Hoang, Kiss, A., Zimmermann, M.
Published in 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (01.10.2009)

by Burghartz, J.N., Appel, W., Harendt, C., Rempp, H., Richter, H., Zimmermann, M.
Published in 2009 Proceedings of ESSCIRC (01.09.2009)

by Angelopoulos, E. A., Al-Shahed, M. S., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M., Rempp, H., Zimmermann, M., Burghartz, J. N.
Published in 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2012)

by Richter, H., Rempp, H.D., Hassan, M.-U., Harendt, C., Wacker, N., Zimmermann, M., Burghartz, J.N.
Published in 2009 IEEE International Conference on IC Design and Technology (01.05.2009)