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CAREY CHARLES F, QUESTAD DAVID L, MALHOTRA ASHWANI K, SAUTER WOLFGANG, HANSEN BERNT JULIUS
Year of Publication 14.12.2010
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Year of Publication 14.12.2010
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Semiconductor chip used in flip chip process
Carey, Charles F, Hansen, Bernt Julius, Malhotra, Ashwani K, Questad, David L, Sauter, Wolfgang
Year of Publication 14.12.2010
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Year of Publication 14.12.2010
Patent
SEMICONDUCTOR CHIP USED IN FLIP CHIP PROCESS
CAREY CHARLES F, QUESTAD DAVID L, MALHOTRA ASHWANI K, SAUTER WOLFGANG, HANSEN BERNT JULIUS
Year of Publication 24.06.2010
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Year of Publication 24.06.2010
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Monitoring cool-down stress in a flip chip process using monitor solder bump structures
CAREY CHARLES F, QUESTAD DAVID L, MALHOTRA ASHWANI K, SAUTER WOLFGANG, HANSEN BERNT JULIUS
Year of Publication 09.03.2010
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Year of Publication 09.03.2010
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Monitoring cool-down stress in a flip chip process using monitor solder bump structures
Carey, Charles F, Hansen, Bernt Julius, Malhotra, Ashwani K, Questad, David L, Sauter, Wolfgang
Year of Publication 09.03.2010
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Year of Publication 09.03.2010
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Monitoring Cool-Down Stress in a Flip Chip Process Using Monitor Solder Bump Structures
CAREY CHARLES F, QUESTAD DAVID L, MALHOTRA ASHWANI K, SAUTER WOLFGANG, HANSEN BERNT JULIUS
Year of Publication 20.11.2008
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Year of Publication 20.11.2008
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