The equilibrium crystal shape of strontium titanate and its relationship to the grain boundary plane distribution
Rheinheimer, Wolfgang, Bäurer, Michael, Chien, Harry, Rohrer, Gregory S., Handwerker, Carol A., Blendell, John E., Hoffmann, Michael J.
Published in Acta materialia (01.01.2015)
Published in Acta materialia (01.01.2015)
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Journal Article
Intrinsic and Interdiffusion in Cu-Sn System
Kumar, Santosh, Handwerker, Carol A., Dayananda, Mysore A.
Published in Journal of phase equilibria and diffusion (01.08.2011)
Published in Journal of phase equilibria and diffusion (01.08.2011)
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Journal Article
In Situ Study on Cu-to-Cu Thermal Compression Bonding
Niu, Tongjun, Xu, Ke, Shen, Chao, Sun, Tianyi, Oberst, Justin, Handwerker, Carol A., Subbarayan, Ganesh, Wang, Haiyan, Zhang, Xinghang
Published in Crystals (Basel) (01.07.2023)
Published in Crystals (Basel) (01.07.2023)
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Journal Article
Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder
Koppes, John P., Grossklaus, Kevin A., Muza, Anthony R., Revur, R. Rao, Sengupta, Suvankar, Rae, Alan, Stach, Eric A., Handwerker, Carol A.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.02.2012)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.02.2012)
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Journal Article
Metal-metal chalcogenide molecular precursors to binary, ternary, and quaternary metal chalcogenide thin films for electronic devices
Zhang, Ruihong, Cho, Seonghyuk, Lim, Daw Gen, Hu, Xianyi, Stach, Eric A, Handwerker, Carol A, Agrawal, Rakesh
Published in Chemical communications (Cambridge, England) (01.01.2016)
Published in Chemical communications (Cambridge, England) (01.01.2016)
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Journal Article
Sb Additions in Near-Eutectic Sn-Bi Solder Decrease Planar Slip
Fowler, Hannah N., Loaiza, Alexandra, Bahr, David F., Blendell, John E., Handwerker, Carol A.
Published in Journal of electronic materials (01.11.2023)
Published in Journal of electronic materials (01.11.2023)
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Journal Article
Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys
Fowler, Hannah N., Puttur Lakshminarayana, Sukshitha Achar, Lai, Sean Yenyu, Tay, Sui Xiong, Masaeng, Aleena, Subbarayan, Ganesh, Blendell, John E., Handwerker, Carol A.
Published in Journal of electronic materials (01.03.2024)
Published in Journal of electronic materials (01.03.2024)
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Journal Article
Growth of single crystalline seeds into polycrystalline strontium titanate: Anisotropy of the mobility, intrinsic drag effects and kinetic shape of grain boundaries
Rheinheimer, Wolfgang, Bäurer, Michael, Handwerker, Carol A., Blendell, John E., Hoffmann, Michael J.
Published in Acta materialia (15.08.2015)
Published in Acta materialia (15.08.2015)
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Journal Article
Microalloying effects of Sb and Ag on the microstructural evolution of eutectic Sn–Bi alloys
Fowler, Hannah N., Tay, Sui Xiong, Blendell, John, Handwerker, Carol A.
Published in MRS advances (01.10.2023)
Published in MRS advances (01.10.2023)
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Journal Article
Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
Fan, Yaohui, Wu, Yifan, Dale, Travis F., Lakshminarayana, Sukshitha Achar Puttur, Greene, Colin V., Badwe, Nilesh U., Aspandiar, Raiyo F., Blendell, John E., Subbarayan, Ganesh, Handwerker, Carol A.
Published in Journal of electronic materials (01.12.2021)
Published in Journal of electronic materials (01.12.2021)
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Journal Article
Evolution of tin whiskers and subsiding grains in thermal cycling
Wang, Ying, Blendell, John E., Handwerker, Carol A.
Published in Journal of materials science (01.02.2014)
Published in Journal of materials science (01.02.2014)
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Journal Article
Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films
Sarobol, P, Pedigo, A E, Su, P, Blendell, J E, Handwerker, C A
Published in IEEE transactions on electronics packaging manufacturing (01.07.2010)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2010)
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Journal Article