Super fine cerium hydroxide abrasives for SiO2 film chemical mechanical planarization performing scratch free
Son, Young-Hye, Jeong, Gi-Ppeum, Kim, Pil-Su, Han, Man-Hyup, Hong, Seong-Wan, Bae, Jae-Young, Kim, Sung-In, Park, Jin-Hyung, Park, Jea-Gun
Published in Scientific reports (06.09.2021)
Published in Scientific reports (06.09.2021)
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Journal Article
Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical–mechanical-planarization polishing-rate
Jeong, Gi-Ppeum, Park, Jun-Seong, Lee, Seung-Jae, Kim, Pil-su, Han, Man-Hyup, Hong, Seong-Wan, Kim, Eun-Seong, Park, Jin-Hyung, Choo, Byoung-Kwon, Kang, Seung-Bae, Park, Jea-Gun
Published in Scientific reports (01.03.2022)
Published in Scientific reports (01.03.2022)
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Journal Article
Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate
Bae, Jae-Young, Han, Man-Hyup, Lee, Seung-Jae, Kim, Eun-Seong, Lee, Kyungsik, Lee, Gon-Sub, Park, Jin-Hyung, Park, Jea-Gun
Published in Nanomaterials (Basel, Switzerland) (04.11.2022)
Published in Nanomaterials (Basel, Switzerland) (04.11.2022)
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Fenton Reaction for Enhancing Polishing Rate and Protonated Amine Functional Group Polymer for Inhibiting Corrosion in Ge1Sb4Te5 Film Surface Chemical-Mechanical-Planarization
Jeong, Gi-Ppeum, Son, Young-Hye, Park, Jun-Seong, Kim, Pil-Su, Han, Man-Hyup, Hong, Seong-Wan, Park, Jin-Hyung, Cui, Hao, Yoon, Bo-Un, Park, Jea-Gun
Published in Applied sciences (01.11.2021)
Published in Applied sciences (01.11.2021)
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