The Effect of Hydrogen Peroxide in a Citric Acid Based Copper Slurry on Cu Polishing
Eom, Dae-Hong, Kim, In-Kwon, Han, Ja-Hyung, Park, Jin-Goo
Published in Journal of the Electrochemical Society (01.01.2007)
Published in Journal of the Electrochemical Society (01.01.2007)
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Journal Article
Formation of Cobalt-BTA Complexes and Their Removal from Various Surfaces Relevant to Cobalt Interconnect Applications
Seo, Jihoon, Vegi, S. S. R. K. Hanup, Ranaweera, C. K., Baradanahalli, N. K., Han, Ja-Hyung, Koli, Dinesh, Babu, S. V.
Published in ECS journal of solid state science and technology (2019)
Published in ECS journal of solid state science and technology (2019)
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Journal Article
Brush cleaning effect on tugnsten voids defect in chemical mechanical polishing: CFM: Contamination free manufacturing
Kim, Hong Jin, Egan, Bryan, Solan, Robert, Shi, Xingzhao, Han, Ja-Hyung
Published in 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.04.2018)
Published in 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.04.2018)
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Conference Proceeding
CMP: Consideration of Stop-on Selectivity in Advanced Node Semiconductor Manufacturing Technology
Tsai, Stan, Amanapu, Hari, Xie, Ruilong, Zhang, John, Chung, Kisup, Labelle, Cathy, Huang, Haigou, Han, Ja-Hyung, Koli, Dinesh R, Surisetty, Charan
Published in ECS transactions (25.04.2017)
Published in ECS transactions (25.04.2017)
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Journal Article
Study on the Polishing Performance of Silicon Carbonitride (SiCN)
Qin, Liqiao, Gu, Sipeng, Kim, Hong Jin, Han, Ja-Hyung, Koli, Dinesh R
Published in ECS transactions (28.07.2016)
Published in ECS transactions (28.07.2016)
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Journal Article
Microreplicated CMP pad for RMG and MOL metallization
Wei-Tsu Tseng, Changhong Wu, Hagan, James, Yanni Wang, Hong Lin, Ja-Hyung Han, Koli, Dinesh
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
SiOC CMP developed and implemented in 7nm and beyond
Haigou Huang, Taifong Chao, Ja-Hyung Han, Koli, Dinesh, Qiang Fang
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)
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Conference Proceeding
Cobalt CMP Development for 7nm Logic Device
Wu, Changhong, Han, Ja-Hyung, Shi, Xingzhao, Koli, Dinesh R, Penigalapati, Dinesh
Published in ECS transactions (26.04.2017)
Published in ECS transactions (26.04.2017)
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Journal Article
Cobalt CMP Development for 7nm Logic Device
Wu, Changhong, Han, Ja-Hyung, Shi, Xingzhao, Koli, Dinesh R, Penigalapati, Dinesh
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
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Journal Article
Initial Study on the Polishing Performance of Nitrogen-Doped Silicon Carbide (SiC)
Qin, Liqiao, Gu, Sipeng, Kim, Hong Jin, Han, Ja-Hyung, Koli, Dinesh R
Published in Meeting abstracts (Electrochemical Society) (01.04.2016)
Published in Meeting abstracts (Electrochemical Society) (01.04.2016)
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Journal Article
CMP: Consideration of Stop-on Selectivity in Advanced Node Semiconductor Manufacturing Technology
Tsai, Stan, Amanapu, Hari, Xie, Ruilong, Zhang, John, Chung, Kisup, Labelle, Cathy, Huang, Haigou, Han, Ja-Hyung, Koli, Dinesh R, Surisetty, Charan
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
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Journal Article
Siloxane and organic-based MOL contact patterning
Lim, SangWoo, Huang, Haigou, Krishnan, Bharat, Bates, Kenneth A, Pal, Shyam, Maeng, Chang Ho, Liu, Jinping, Wei, Andy, Ozzello, Anthony, Dai, Xintuo, Bouche, Guillaume, Han, Ja-Hyung, Cao, Huy M, Sheng, Haifeng, Liu, Huang
Year of Publication 21.08.2018
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Year of Publication 21.08.2018
Patent
SILOXANE AND ORGANIC-BASED MOL CONTACT PATTERNING
CAO Huy M, BATES Kenneth A, PAL Shyam, BOUCHE Guillaume, HUANG Haigou, LIU Huang, DAI Xintuo, KRISHNAN Bharat, WEI Andy, LIM SangWoo, SHENG Haifeng, LIU Jinping, HAN Ja-Hyung, OZZELLO Anthony, MAENG Chang Ho
Year of Publication 13.07.2017
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Year of Publication 13.07.2017
Patent