Lithographic Performance and Insulation Reliability of a Novel i-Line Photosensitive Dielectric Material
Inoue, Go, Yukimori, Daiki, Shibasaki, Kaho, Okuda, Ayano, Ishikawa, Nobuhiro, Han, Young-Gun, Kanayama, Taka, Suetsugu, Tadashi, Ogata, Toshiyuki
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Advanced ion beam technology for versatile oxide thin film formation
Han, Young-gun, Lee, Jung Hwan, Yeo, Un-Jung, Song, Seok-Kyun, Sung, Jin-Wook, Cho, Jun-Sik, Koh, Seok-Keun, Kim, Huynjoo
Published in Current applied physics (01.07.2007)
Published in Current applied physics (01.07.2007)
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Journal Article
Preparation of a novel poloxamer hydrogel
Kweon, HaeYong, Yoo, Mi-Kyong, Lee, Jin-Hak, Wee, Won-Ryang, Han, Young-Gun, Lee, Kwang-Gill, Cho, Chong-Su
Published in Journal of applied polymer science (13.06.2003)
Published in Journal of applied polymer science (13.06.2003)
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Journal Article
Thin Film Growth and Surface Modification by keV Ion Beam
Choi, Sung-Chang, Park, Yong-Wook, Choi, Won-Kook, Kim, Ki-Hwan, Cho, Jun-Sik, Han, Sung, Cho, Jung, Jung, Sun, Han, Young-Gun, Yoo, Byong-Kook, Jung, Hyung-Jin, Koh, Seok-Keun
Published in Japanese Journal of Applied Physics (01.12.1998)
Published in Japanese Journal of Applied Physics (01.12.1998)
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Journal Article
Through cavity core device-embedded substrate for ultra-fine-pitch Si bare chips; (Fabrication feasibility and residual stress evaluation)
Young-Gun Han, Horiuchi, Osamu, Hayashi, Shigehiro, Nogita, Kanta, Katoh, Yoshihisa, Tomokage, Hajime
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Evaluation of residual stress caused by flip-chip bonding process using piezo-resistor embedded test element group chips
Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Young-Gun Han, Tomokage, Hajime
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Residual stress evaluation of flip-chip bonding with non-conductive films on organic substrate and silicon interposer by piezo-sensor embedded test element group chips
Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Young-Gun Han, Tomokage, Hajime
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Material properties and growth control of undoped and Sn-doped In2O3 thin films prepared by using ion beam technologies
KOH, Seok-Keun, HAN, Young-Gun, JUNG HWAN LEE, YEO, Un-Jung, CHO, Jun-Sik
Published in Thin solid films (01.02.2006)
Published in Thin solid films (01.02.2006)
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Conference Proceeding
Journal Article
Entomopathogenic Nematodes for Biological Control of Pryeria sinica Moore (Lepidoptera: Zygaenidae) and Persistence on Euonymus japonica Thunberg Foliage
Lee, Dong Woon, Yang, Jae Yun, Han, Gun Young, Choo, Ho Yul, Lee, Sang Myeong, Kim, Hyeong Hwan, Park, Chung Gyoo, Choo, Young Moo
Published in Journal of Asia-Pacific entomology (01.06.2006)
Published in Journal of Asia-Pacific entomology (01.06.2006)
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Journal Article