CMP PROCESS MONITORING PATTERN WITH DUMMY PATTERN
SON, HONG SEONG, HA, SANG ROK, LEE, SEONG BAE, HAN, JA HYEONG, HONG, DEOK HO
Year of Publication 30.07.2004
Get full text
Year of Publication 30.07.2004
Patent
POLISHING APPARATUS AND POLISHING METHOD USING THE SAME
PARK, MU YONG, SON, HONG SEONG, KIM, JONG GYUN, HA, SANG ROK, HAN, JA HYEONG
Year of Publication 21.07.2004
Get full text
Year of Publication 21.07.2004
Patent
Wafer forming monitoring points
SON, HONG SEONG, HA, SANG ROK, LEE, SEONG BAE, HAN, JA HYEONG, HONG, DEOK HO
Year of Publication 05.07.2004
Get full text
Year of Publication 05.07.2004
Patent
Method and apparatus for polishing of Cu layer and method for forming of wiring using Cu
PARK, BYEONG RYUL, SON, HONG SEONG, HA, SANG ROK, HAN, JA HYEONG, HONG, DEOK HO
Year of Publication 29.03.2003
Get full text
Year of Publication 29.03.2003
Patent
METHOD MANUFACTURING OF A METAL LINE USING A DAMASCENE PROCESS
SON, HONG SEONG, KIM, JONG GYUN, HA, SANG ROK, LEE, SEONG BAE, HAN, JA HYEONG, HONG, DEOK HO
Year of Publication 26.09.2003
Get full text
Year of Publication 26.09.2003
Patent