by CHOU, Tsung-Lin, SHIH, Zun-Hao, HONG, Hwen-Fen, HAN, Cheng-Nan, CHIANG, Kou-Ning
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)

by Chi, Wei-Hao, Chou, Tsung-Lin, Han, Cheng-Nan, Yang, Shin-Yueh, Chiang, Kuo-Ning
Published in IEEE transactions on components and packaging technologies (01.12.2010)

by Chou, Tsung-Lin, Yang, Shin-Yueh, Wu, Chung-Jung, Han, Cheng-Nan, Chiang, Kou-Ning
Published in Microelectronics and reliability (01.09.2011)

by Chou, Tsung-Lin, Huang, Chien-Fu, Han, Cheng-Nan, Yang, Shin-Yueh, Chiang, Kuo-Ning
Published in Microelectronics and reliability (01.09.2009)

by Wei-Hao Chi, Tsung-Lin Chou, Cheng-Nan Han, Kuo-Ning Chiang
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)

by LEE TSUNG XIAN, HAN CHENG NAN, CHEN HSING CHAO, LIU HSIN MAO, HSIEH MIN HSUN, NI CHIH PENG, WU JEN CHAU, CHEN TZER PERNG, SANO MASAFUMI, CHEN HUNG HSUAN, TAO CHING SAN, WANG CHIH MING
Year of Publication 22.07.2020

by LEE TSUNG XIAN, HAN CHENG NAN, CHEN HSING CHAO, LIU HSIN MAO, HSIEH MIN HSUN, NI CHIH PENG, WU JEN CHAU, CHEN TZER PERNG, SANO MASAFUMI, CHEN HUNG HSUAN, TAO CHING SAN, WANG CHIH MING
Year of Publication 23.09.2019

by LIU HSIN-MAO, TAO CHING-SAN, WANG CHIH-MING, HSIEH MIN-HSUN, NI CHIH-PENG, CHEN HUNG-HSUAN, CHEN TZER-PERNG, SANO MASAFUMI, CHEN HSINGAO, LEE TSUNG-XIAN, WU JENAU, HAN CHENG-NAN
Year of Publication 09.05.2019

by LEE TSUNG XIAN, HAN CHENG NAN, CHEN HSING CHAO, LIU HSIN MAO, HSIEH MIN HSUN, NI CHIH PENG, WU JEN CHAU, CHEN TZER PERNG, SANO MASAFUMI, CHEN HUNG HSUAN, TAO CHING SAN, WANG CHIH MING
Year of Publication 30.10.2018

by Chung-Jung Wu, Chan-Yen Chou, Cheng-Nan Han, Kuo-Ning Chiang
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)

by LIU HSIN-MAO, TAO CHING-SAN, WANG CHIH-MING, HSIEH MIN-HSUN, NI CHIH-PENG, CHEN HUNG-HSUAN, CHEN TZER-PERNG, SANO MASAFUMI, CHEN HSINGAO, LEE TSUNG-XIAN, WU JENAU, HAN CHENG-NAN
Year of Publication 02.11.2017

by LEE TSUNG XIAN, HAN CHENG NAN, CHEN HSING CHAO, LIU HSIN MAO, HSIEH MIN HSUN, NI CHIH PENG, WU JEN CHAU, CHEN TZER PERNG, SANO MASAFUMI, CHEN HUNG HSUAN, TAO CHING SAN, WANG CHIH MING
Year of Publication 11.03.2016

by LIU HSIN-MAO, TAO CHING-SAN, WANG CHIH-MING, HSIEH MIN-HSUN, NI CHIH-PENG, CHEN HUNG-HSUAN, CHEN TZER-PERNG, SANO MASAFUMI, CHEN HSINGAO, LEE TSUNG-XIAN, WU JENAU, HAN CHENG-NAN
Year of Publication 05.11.2015

by LEE TSUNG XIAN, HAN CHENG NAN, CHEN HSING CHAO, LIU HSIN MAO, HSIEH MIN HSUN, NI CHIH PENG, WU JEN CHAU, CHEN TZER PERNG, SANO MASAFUMI, CHEN HUNG HSUAN, TAO CHING SAN, WANG CHIH MING
Year of Publication 06.02.2014

by Chou, Tsung-Lin, Yang, Shin-Yueh, Wu, Chung-Jung, Han, Cheng-Nan, Chiang, Kou-Ning
Published in Microelectronics and reliability (01.11.2011)

by Tsung-Lin Chou, Zun-Hao Shih, Hwen-Fen Hong, Cheng-Nan Han, Kou-Ning Chiang
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)

by Yuan, C.-A., Cheng Nan Han, Ming-Chih Yew, Chan-Yen Chou, Kou-Ning Chiang
Published in IEEE transactions on advanced packaging (01.08.2005)

by Qi Shi Yingde Wang Zhongmin Wang Yongpeng Lei Bing Wang Nan Wu Cheng Han Song xieJ Yanzi Gou
Published in 纳米研究：英文版 (2016)

by Chang-Ann Yuan, Cheng Nan Han, Kou-Ning Chiang
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)

by Yuan, C., Zhang, G.Q., Ching-Shun Huang, Chun-Hui Yu, Chin-Cheng Yang, Wen-Kung Yang, Ming-Chih Yew, Cheng Nan Han, Kou-Ning Chiang
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)