Low sheet resistance buried metal bit line realized by high-temperature metal CVD process in vertical channel transistor array
Tian, Chao, Sun, Jiabao, Ping, Yanlei, Wang, Naizheng, Han, Baodong, Liu, Zhao, Li, Yongjie, Meng, Jingheng, Sun, Hongbo, Wang, Guilei, Chu, Jian, Shao, Guangsu, Shen, Jie, Qiu, Yunsong, Park, Ted, Xiao, Deyuan, Yoo, Abraham, Zhao, Chao
Published in Japanese Journal of Applied Physics (01.04.2024)
Published in Japanese Journal of Applied Physics (01.04.2024)
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Journal Article
Low Contact Resistance via Quantum Well Structure in Amorphous InMoO Thin Film Transistors
Luo, Jie, Yan, Gangping, Song, Zhiyu, Yang, Yanyu, Bao, Yunjiao, Yang, Shangbo, Niu, Chuqiao, Tian, Guoliang, Han, Baodong, Sun, Hongbo, Wang, Guilei, Xu, Gaobo, Yin, Huaxiang, Zhao, Chao, Luo, Jun
Published in ECS journal of solid state science and technology (02.09.2024)
Published in ECS journal of solid state science and technology (02.09.2024)
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Journal Article
Investigation of CD Precise Control in Pitch Doubling Flow for Memory Industry
Liu, Zhao, Han, Baodong
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
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Conference Proceeding
Tungsten/Silicon Oxide/Titanium Nitride Stack Etching
Luo, Jie, Lyu, Haochang, Hou, Linjie, Han, Baodong, Sun, Hongbo, Zhao, Chao
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
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Conference Proceeding
High Aspect Ratio Contact Profile Control and Cryogenic Etch Process
Luo, Jie, Meng, Jingheng, Han, Baodong, Sun, Hongbo, Xiao, Deyuan, Zhao, Chao
Published in 2021 International Workshop on Advanced Patterning Solutions (IWAPS) (12.12.2021)
Published in 2021 International Workshop on Advanced Patterning Solutions (IWAPS) (12.12.2021)
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Conference Proceeding
Etch Arts of Dual Damascus Structure and Their Impacts on WAT/VBD in 65nm Cu Interconnects
Sun, Wu, Chang, Shih-Mou, Zhang, Haiyang, Yin, Xiaoming, Fu, Liya, Han, Baodong, Wang, Xinpeng, Wu, Yongqin
Published in ECS transactions (06.03.2009)
Published in ECS transactions (06.03.2009)
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Journal Article
Optimize of High-k Capping Layer Loss Thickness in DPRM Process to Avoid Vth Shift
Shi, Meng, Liu, Cheng, Yan, Haitao, Mao, Haiyang, Han, Baodong, Xia, Guangmei
Published in 2019 China Semiconductor Technology International Conference (CSTIC) (01.03.2019)
Published in 2019 China Semiconductor Technology International Conference (CSTIC) (01.03.2019)
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Conference Proceeding
Yield Enhancement with Optimized Offset Spacer Etch for 65nm Logic Low-leakage Process
Han, Baodong, Chang, Shih-Mou, Zhang, Haiyang, Zhao, Lin-Lin, Fu, Ya-Li, Sun, Wu, Liu, Bing-Wu
Published in ECS transactions (06.03.2009)
Published in ECS transactions (06.03.2009)
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Journal Article