by Hamann, H.F., Lacey, J.A., O'Boyle, M., Schmidt, R.R., Iyengar, M.
Published in IEEE transactions on components and packaging technologies (01.06.2008)

by HAMANN, Hendrick F, PANKANTI, Sharathchandra, LU, Siyuan, KLEIN, Levente, KHABIBRAKHMANOV, Ildar, ALBRECHT, Conrad M, ZHOU, Wang, ELMEGREEN, Bruce Gordon, SIEBENSCHUH, Carlo
Year of Publication 01.07.2021