Search Results - "HAM, SUK JIN" :: K.UTB vyhledávací portál

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Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

by Kwon, Woon-Seong, Ham, Suk-Jin, Paik, Kyung-Wook
Published in Microelectronics and reliability (01.02.2006)

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Journal Article

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Characterization of the surface morphology of electroless NiP deposited on conductive Cu film

by Huh, Seok-Hwan, Choi, Sung-Ho, Shin, An-Seob, Jeong, Gi-Ho, Ham, Suk-Jin, Kim, Keun-Soo
Published in Circuit world (02.11.2015)

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Journal Article

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Nucleation and Growth Behaviors of Pd Catalyst and Electroless Ni Deposition on Cu (111) Surface

by Huh, Seok-Hwan, Choi, Sung-Ho, Shin, An-Seob, Ham, Suk-Jin, Moon, Seongjae, Lee, Hyo-Jong
Published in Journal of the Electrochemical Society (01.01.2016)

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Journal Article

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Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages

by Jang, Changsoo, Youn, Byeng Dong, Wang, Ping F., Han, Bongtae, Ham, Suk-Jin
Published in Microelectronics and reliability (01.04.2010)

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Journal Article

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Ultrathin nanoclay films with tunable thickness as barrier layers in organic light emitting devices

by Kim, Jung Kyu, Park, Hyo Suk, Rhee, Do Kyung, Ham, Suk-Jin, Lee, Kwang-Jik, Yoo, Pil J., Park, Jong Hyeok
Published in Journal of materials chemistry (01.01.2012)

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Journal Article

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INTERNAL ELECTRODE PASTE COMPOSITION, AND MULTILAYER TYPE CERAMIC CAPACITOR HAVING INTERNAL ELECTRODE LAYER ARRANGED BY USE THEREOF

by CHO HYE JIN, HAM SUK JIN
Year of Publication 05.02.2015

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Patent

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Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging

by Lee, Soon-Bok, Park, Tae-Sang, Ham, Suk-Jin
Published in JSME International Journal Series A Solid Mechanics and Material Engineering (2000)

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Journal Article Conference Proceeding

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INSPECTING APPARTUS FOR ELECTRONIC ELEMENT

by HAM, SUK JIN, PARK, YONG CHOON
Year of Publication 30.05.2013

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Patent

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THE BONDING METHOD FOR ELECTRONIC COMPONENTS AND THE ELECTRONIC DEVICES BY USING THAT

by HAM, SUK JIN, YOON, HYO JIN, CHO, HYE JIN
Year of Publication 16.06.2015

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Patent

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Reliability Verification of Hermetic Package With Nanoliter Cavity for RF-Micro Device

by JEONG, Byung-Gil, HAM, Suk-Jin, MOON, Chang-Youl, KIM, Byung-Sung
Published in IEEE transactions on advanced packaging (01.02.2010)

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Journal Article

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APPARATUS FOR TESTING SWITCHING OF POWER SEMICONDUCTOR MODULE

by SEO, SHANG HOON, KIM, SEUNG HWAN, HAM, SUK JIN
Year of Publication 07.07.2014

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Patent

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TOUCH PANEL AND PRODUCING METHOD FOR VIA HOLE AND VIA ELECTRODE

by HAM, SUK JIN, PARK, SUNG YEOL, NOH, JUNG EUN
Year of Publication 07.07.2014

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Patent

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EQUIPMENT OF TESTING SEMICONDUCTOR MODULE AND TESTING METHOD USING THE SAME

by SEO, SHANG HOON, KIM, SEUNG HWAN, HAM, SUK JIN
Year of Publication 02.06.2014

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Patent

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SEMICONDUCTOR DEVICE TESTING DEVICE AND TESTING METHOD

by SEO, SHANG HOON, KIM, SEUNG HWAN, HAM, SUK JIN
Year of Publication 30.05.2014

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Patent

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PRINTED CIRCUIT BOARD EMBEDDING ELECTRONIC COMPONENT

by HAM, SUK JIN, HAN, SEUNG HEON, PARK, SUNG YEOL
Year of Publication 28.05.2014

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Patent

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PRINTED CIRCUIT BOARD AND MANUFACTURING THE SAME

by HAM, SUK JIN, PARK, SUNG YEOL, NOH, JUNG EUN
Year of Publication 19.05.2014

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Patent

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NON-INVASIVE INSPECTING APPARATUS FOR DEFECTS AND INSPECTING METHOD USING THE SAME

by HAM, SUK JIN, KIM, JI HOON
Year of Publication 02.07.2013

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Patent

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Wafer-level low temperature bonding with Au-In system

by Yoon-Chul Sohn, Qian Wang, Suk-Jin Ham, Byung-Gil Jeong, Kyu-Dong Jung, Min-Seog Choi, Woon-Bae Kim, Chang-Youl Moon
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)

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Conference Proceeding