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"HALL E. JARMAN"
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"HALL E. JARMAN"
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SEMICONDUCTOR PACKAGE WITH OFFSET DIE PAD AND METHOD FOR MANUFACTURING SAME
by
HALL E
.
JARMAN
,
WILLIAM P. STEARNS
Year of Publication
15.10.2002
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High depth-to-width ratio etching process for monocrystalline germanium semiconductor materials
by
JARMAN
;
HALL E
Year of Publication
31.08.1976
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HIGH DEPTH TO WIDTH RATIO ETCHING PROCESS
by
HALL E
.
JARMAN
Year of Publication
20.04.1971
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HIGH DEPTH-TO-WIDTH RATIO ETCHING PROCESS
by
HALL E
.
JARMAN
Year of Publication
01.12.1970
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Semiconductor package with offset die pad
by
JARMAN
;
HALL E
,
HASSANZADEH; NOZAR
,
STEARNS; WILLIAM P
Year of Publication
29.08.2000
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Improvements in or relating to semiconductor device packaging
by
JARMAN
,
HALL E
,
STEARNS, WILLIAM P
,
HASSANTADEH, NOZAR
Year of Publication
05.04.2000
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SEMICONDUCTOR PACKAGE HAVING OFFSET DIE PAD AND ITS MANUFACTURE
by
HASSANTADEH NOZAR
,
JARMAN HALL E
,
STEARNS WILLIAM P
Year of Publication
25.09.1998
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Improvements in or relating to semiconductor device packaging
by
JARMAN
,
HALL E
,
STEARNS, WILLIAM P
,
HASSANTADEH, NOZAR
Year of Publication
22.07.1998
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Printed circuit board switch
by
JARMAN
;
HALL E
,
HAESLY; BARRY F
Year of Publication
30.06.1981
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PROCESS FOR FABRICATING GE:HG INFRARED DETECTOR ARRAYS AND RESULTING ARTICLE OF MANUFACTURE
by
HALL E
.
JARMAN
,
ERNEST G. BYLANDER
Year of Publication
21.11.1972
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PROCESS FOR FABRICATING INFRARED DETECTOR ARRAYS AND RESULTING ARTICLE OF MANUFACTURE
by
HALL E
.
JARMAN
,
ERNEST G. BYLANDER
Year of Publication
04.05.1971
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Inorganic glass composition
by
JARMAN HALL E
,
BRAU MAURICE J
Year of Publication
27.02.1968
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Semiconductor package with offset die pad and method for manufacturing same
by
HASSANZADEH, NOZAR
,
JARMAN
,
HALL E
,
STEARNS, WILLIAM P
Year of Publication
21.09.1999
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