SYSTEM AND METHOD FOR TEMPERATURE SENSING USING THERMOPILE INTEGRATED WITH FLEXIBLE CIRCUIT
KO, Jacky G, LIN, Chia-Hsien, HUANG, Kuo Jen, HOANG, Lan Hoang, CHEN, Hongling, MEHRA, Saahil, LEE, Joseph R, AMIN, Ali M, BUCHHOLZ, Jeffrey W, HUANG, Wanfeng, CHU, Xinsheng, TANG, Sherry, ZHANG, Leilei, TADELE, Wegene H, LABOVE, Daniel W, KARAKI, Habib S, HAIDRI, Jafir A, HAN, Chin San, CLEMENTS, James C, D'SOUZA, Craig C, CHOU, Fred Y, CHEN, Esther
Year of Publication 28.06.2023
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Year of Publication 28.06.2023
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TEMPERATURE SENSING SYSTEMS AND METHODS INCLUDING MULTIPLE TEMPERATURE SENSORS
KO, Jacky G, LIN, Chia-Hsien, HUANG, Kuo Jen, HOANG, Lan Hoang, CHEN, Hongling, MEHRA, Saahil, LEE, Joseph R, AMIN, Ali M, BUCHHOLZ, Jeffrey W, HUANG, Wanfeng, CHU, Xinsheng, TANG, Sherry, ZHANG, Leilei, TADELE, Wegene H, LABOVE, Daniel W, KARAKI, Habib S, HAIDRI, Jafir A, HAN, Chin San, CLEMENTS, James C, D'SOUZA, Craig C, CHOU, Fred Y, CHEN, Esther
Year of Publication 28.06.2023
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Year of Publication 28.06.2023
Patent
SYSTEM AND METHOD FOR TEMPERATURE SENSING USING THERMOPILE INTEGRATED WITH FLEXIBLE CIRCUIT
KO, Jacky G, LIN, Chia-Hsien, HUANG, Kuo Jen, HOANG, Lan Hoang, CHEN, Hongling, MEHRA, Saahil, LEE, Joseph R, AMIN, Ali M, BUCHHOLZ, Jeffrey W, HUANG, Wanfeng, CHU, Xinsheng, TANG, Sherry, ZHANG, Leilei, TADELE, Wegene H, LABOVE, Daniel W, KARAKI, Habib S, HAIDRI, Jafir A, HAN, Chin San, CLEMENTS, James C, D'SOUZA, Craig C, CHOU, Fred Y, CHEN, Esther
Year of Publication 19.04.2023
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Year of Publication 19.04.2023
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TEMPERATURE SENSING SYSTEMS AND METHODS INCLUDING MULTIPLE TEMPERATURE SENSORS
KO, Jacky G, LIN, Chia-Hsien, HUANG, Kuo Jen, HOANG, Lan Hoang, CHEN, Hongling, MEHRA, Saahil, LEE, Joseph R, AMIN, Ali M, BUCHHOLZ, Jeffrey W, HUANG, Wanfeng, CHU, Xinsheng, TANG, Sherry, ZHANG, Leilei, TADELE, Wegene H, LABOVE, Daniel W, KARAKI, Habib S, HAIDRI, Jafir A, HAN, Chin San, CLEMENTS, James C, D'SOUZA, Craig C, CHOU, Fred Y, CHEN, Esther
Year of Publication 19.04.2023
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Year of Publication 19.04.2023
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SYSTEM AND METHOD FOR TEMPERATURE SENSING USING THERMOPILE INTEGRATED WITH RIGID PRINTED CIRCUIT BOARD
KO, Jacky G, LIN, Chia-Hsien, HOANG, Lan Hoang, CHEN, Hongling, MEHRA, Saahil, LEE, Joseph R, AMIN, Ali M, BUCHHOLZ, Jeffrey W, HUANG, Wanfeng, CHU, Xinsheng, TANG, Sherry, ZHANG, Leilei, TADELE, Wegene H, LABOVE, Daniel W, KARAKI, Habib S, HAIDRI, Jafir A, HAN, Chin San, CLEMENTS, James C, D'SOUZA, Craig C, CHOU, Fred Y, CHEN, Esther
Year of Publication 29.03.2023
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Year of Publication 29.03.2023
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