Improvement of C2W Collective Bonding Reliability and UPH through Innovations in Machine, Materials and Methods
Nakamura, Tomonori, Shafiq, Farhan, Otani, Tetsuya, Watanabe, Osamu, Maeda, Toru, Hagiwara, Yoshihito, Honjo, Keiji, Owada, Tamotsu, Mori, Daichi, Egashira, Outa, Nagamatsu, Tatsuo
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
CREEP-PREVENTING PTFE SHEET USED FOR DIE MOUNTING, AND METHOD FOR MOUNTING DIE
HAGIWARA, Yoshihito, NAKAMURA, Tomonori, WATANABE, Osamu, KANAI, Yuji
Year of Publication 06.06.2019
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Year of Publication 06.06.2019
Patent