Search Results - "HAGA MASAKI" :: K.UTB vyhledávací portál

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LEAD-FREE TIN ALLY ELCTROPLATING METHOD AND PLATING BATH FOR SUPPRESSING DISSOLUTION CURRENT OF ANODE USED IN THE METHOD

by FUKAMI TAKUO, YOSHIMOTO MASAKAZU, NISHIKAWA TETSUJI, HAGA MASAKI, OBATA KEIGO
Year of Publication 05.10.2006

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Patent

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SILVER PLATING BATH FOR CUPROUS MATERIAL

by TANAKA KAORU, NISHIKAWA TETSUJI, INAI SHOYA, HAGA MASAKI
Year of Publication 10.08.2006

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Patent

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SUBSTITUTION PLATING BATH OF BISMUTH FOR COPPER BASED STOCK MATERIAL

by TANAKA KAORU, NISHIKAWA TETSUJI, INAI SHOYA, HAGA MASAKI
Year of Publication 13.07.2006

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Patent

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LEAD-FREE ACIDIC TIN-BISMUTH BASED ALLOY ELECTROPLATING BATH

by FUKAMI TAKUO, YOSHIMOTO MASAKAZU, NISHIKAWA TETSUJI, HAGA MASAKI, OBATA KEIGO
Year of Publication 11.05.2006

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Patent

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LEAD-FREE TIN-SILVER BASED ALLOY OR TIN-COPPER BASED ALLOY ELECTROPLATING BATH

by TANAKA KAORU, YOSHIMOTO MASAKAZU, NISHIKAWA TETSUJI, INAI SHOYA, HAGA MASAKI, OBATA KEIGO
Year of Publication 08.06.2006

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Patent

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LEAD-FREE TIN-BISMUTH BASED ALLOY ELECTROPLATING BATH

by TANAKA KAORU, YOSHIMOTO MASAKAZU, NISHIKAWA TETSUJI, INAI SHOYA, HAGA MASAKI, OBATA KEIGO
Year of Publication 23.02.2006

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Patent

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Formation of Yttrium Oxide Composite Films by Electrodeposition in Organic Solutions

by MATSUDA, Yoshiharu, YAMATANI, Manabu, YOSHIMOTO, Nobuko, MORITA, Masayuki, ISHIKAWA, Masashi, HAGA, Masaki
Published in Hyōmen gijutsu (01.12.1995)

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Journal Article

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ELECTROLESS TIN AND ELECTROLESS TIN-LEAD ALLOY PLATING BATH

by TSUJI SEIKI, MIYAZAKI MICHIHIDE, HAGA MASAKI
Year of Publication 27.07.1993

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Patent

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JP2649750B

by HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Year of Publication 03.09.1997

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Patent

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JP2649749B

by HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Year of Publication 03.09.1997

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Patent

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JPH0828561B

by NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, UCHIDA MAMORU
Year of Publication 21.03.1996

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Patent

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CATALYTIC SOLUTION FOR ELECTROLESS PLATING SELECTIVE TO COPPER-BASED MATERIAL

by HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Year of Publication 13.01.1995

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Patent

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CATALYST LIQUID SELECTIVE OF COPPER-BASE MATERIAL FOR ELECTROLESS PLATING

by HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Year of Publication 12.04.1994

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Patent

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AUTOMATIC CONTROL METHOD FOR ELECTROLESS PLATING BATH

by NAWAFUNE HIDEMI, MIZUMOTO SHOZO, NISHIKAWA TETSUJI, HAGA MASAKI
Year of Publication 15.02.1994

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Patent

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CATALYST LIQUID FOR COPPER BASE MATERIAL-SELECTING ELECTROLESS PLATING

by HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Year of Publication 17.12.1992

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Patent

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CATALYST LIQUID FOR COPPER BASE SELECTING ELECTROLESS PLATING

by HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Year of Publication 17.12.1992

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Patent

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PRINTED WIRING BOARD AND MANUFACTURE THEREOF

by NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, UCHIDA MAMORU
Year of Publication 25.08.1992

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Patent

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MATERIAL FOR DIRECT VALCANIZING ADHESION OF RUBBER, DIRECT VALCANIZING ADHESION METHOD BETWEEN RUBBER AND METAL, AND LAMINATED MATERIAL PREPARED BY SUBJECTING RUBBER TO DIRECT VALCANIZING ADHESION TO METAL

by NAWAFUNE HIDEMI, MIZUMOTO SHOZO, IKEDA YOSHIYUKI, HAGA MASAKI
Year of Publication 24.06.1992

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Patent

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PALLADIUM-NICKEL-PHOSPHORUS ALLOY ELECTROPLATING SOLUTION

by NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, OKADA TAKASHI
Year of Publication 24.04.1992

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Patent

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COPPER ELECTROPLATING SOLUTION

by NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, UCHIDA MAMORU
Year of Publication 21.04.1992

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Patent

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