Formation, distribution and failure effects of voids in vapor-phase soldered small solder volumes
Villain, J., Beschorner, M., Hacke, H.J., Brabetz, B., Zapf, J.
Published in Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) (2000)
Published in Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) (2000)
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