Nondestructive Inspection of Cylindrical Components Repaired Via Directed Energy Deposition Using Scanning Acoustic Microscopy with Metal Lubricants
Park, Seong-Hyun, Choi, Sungho, Jhang, Kyung-Young, Ha, Tae-ho
Published in Metals and materials international (01.09.2023)
Published in Metals and materials international (01.09.2023)
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Journal Article
Combined Anterolateral Ligament Reconstruction Results in Better Knee Stability and More Satisfactory Subjective Outcomes in Non-Athlete Patients Undergoing Revision Anterior Cruciate Ligament Reconstruction
Jung, Se-Han, Park, Ji-Soo, Jung, Min, Chung, Kwangho, Ha, Tae-Ho, Choi, Chong Hyuk, Kim, Sung-Hwan
Published in Journal of clinical medicine (12.07.2024)
Published in Journal of clinical medicine (12.07.2024)
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Journal Article
Publication rates for abstracts presented by Korean investigators at major radiology meetings
Ha, Tae Ho, Yoon, Dae Young, Goo, Dong Hyun, Chang, Suk Ki, Seo, Young Lan, Yun, Eun Joo, Moon, Jeung Hee, Lee, Yu-Jin, Lim, Kyoung Ja, Choi, Chul Soon
Published in Korean journal of radiology (01.08.2008)
Published in Korean journal of radiology (01.08.2008)
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Journal Article
A study on wafer level TSV build-up integration method
Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
High reliability insert-bump bonding process for 3D integration
Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Bonding head design for thin wafer
Changwoo Lee, Jaehak Lee, Tae Ho Ha, Junyeob Song
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Low temperature hybrid bonding using self-alignment
Jae Hak Lee, Tae Ho Ha, Chang Woo Lee, Jun-Yeob Song, Choong Don Yoo
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Pre-bonding method using self-alignment effect for multichip packaging
Jae Hak Lee, Tae Ho Ha, Chang Woo Lee, Jun-Yeob Song, Min Seok Cha, Choong Don Yoo
Published in 2009 IEEE International Symposium on Assembly and Manufacturing (01.11.2009)
Published in 2009 IEEE International Symposium on Assembly and Manufacturing (01.11.2009)
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Conference Proceeding
Fault Diagnosis of VCM Type AF Actuator Module for Phone Camera by Vibration Analysis
Lee, Chang Woo, Kim, Young Jun, Song, Jun Yeob, Ha, Tae Ho, Lee, Jae Hak
Published in Applied Mechanics and Materials (01.10.2013)
Published in Applied Mechanics and Materials (01.10.2013)
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Journal Article