Confining effects of circular concrete tests reinforced PET fiber
Ha, Sang-Su, Ho, SeungWoung
Published in Journal of Asian architecture and building engineering (04.03.2019)
Published in Journal of Asian architecture and building engineering (04.03.2019)
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Journal Article
Effect of multiple reflows on interfacial reaction and shear strength of Sn–Ag electroplated solder bumps for flip chip package
Ha, Sang-Su, Jang, Jin-Kyu, Ha, Sang-Ok, Yoon, Jeong-Won, Lee, Hoo-Jeong, Joo, Jin-Ho, Kim, Young-Ho, Jung, Seung-Boo
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
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Journal Article
Conference Proceeding
Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints
Kim, Dae-Gon, Kim, Jong-Woong, Ha, Sang-Su, Noh, Bo-In, Koo, Ja-Myeong, Park, Dong-Woon, Ko, Myung-Wan, Jung, Seung-Boo
Published in Journal of alloys and compounds (30.06.2008)
Published in Journal of alloys and compounds (30.06.2008)
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Journal Article
Extracellular matrices derived from different cell sources and their effect on macrophage behavior and wound healing
Savitri, Cininta, Ha, Sang Su, Liao, Emily, Du, Ping, Park, Kwideok
Published in Journal of materials chemistry. B, Materials for biology and medicine (04.11.2020)
Published in Journal of materials chemistry. B, Materials for biology and medicine (04.11.2020)
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Journal Article
Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test
Jeon, Seong-jae, Hyun, Seungmin, Lee, Hak-Joo, Kim, Jong-Woong, Ha, Sang-Su, Yoon, Jeong-Won, Jung, Seung-Boo, Lee, Hoo-Jeong
Published in Microelectronic engineering (01.10.2008)
Published in Microelectronic engineering (01.10.2008)
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Journal Article
Conference Proceeding
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
Kim, Jong-Woong, Jang, Jin-Kyu, Ha, Sang-Ok, Ha, Sang-Su, Kim, Dae-Gon, Jung, Seung-Boo
Published in Microelectronics and reliability (01.11.2008)
Published in Microelectronics and reliability (01.11.2008)
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Journal Article
CPI reliability and EMI benefit for MIM CAP embedded C4 package
Hyunsuk Chun, In Hak Baick, Sang-Su Ha, Eunmi Kwon, Seungbae Lee, Seil Kim, Sangwoo Pae, Jongwoo Park
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Novel skin patch combining human fibroblast-derived matrix and ciprofloxacin for infected wound healing
Suhaeri, Muhammad, Noh, Mi Hee, Moon, Ji-Hoi, Kim, In Gul, Oh, Seung Ja, Ha, Sang Su, Lee, Jong Ho, Park, Kwideok
Published in Theranostics (01.01.2018)
Published in Theranostics (01.01.2018)
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Journal Article
Human Fibroblast‐Derived Matrix Hydrogel Accelerates Regenerative Wound Remodeling Through the Interactions with Macrophages
Savitri, Cininta, Ha, Sang Su, Kwon, Jae Won, Kim, Sung Hoon, Kim, Young‐Min, Park, Hyun Mee, Kwon, Haejin, Ji, Mi Jung, Park, Kwideok
Published in Advanced science (01.05.2024)
Published in Advanced science (01.05.2024)
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Journal Article
Effects of Ag content on electromigration of Sn-Ag solder bumps in C4 package
Sang-Su Ha, Hyunsuk Chun, Hyun-Jun Choi, Bo-In Noh, Park, J.
Published in 2012 IEEE International Integrated Reliability Workshop Final Report (01.10.2012)
Published in 2012 IEEE International Integrated Reliability Workshop Final Report (01.10.2012)
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Conference Proceeding
Performance Evaluation of Semi Precast Concrete Beam-Column Connections with U-Shaped Strands
Ha, Sang-Su, Kim, Seung-Hun, Lee, Moon Sung, Moon, Jeong-Ho
Published in Advances in structural engineering (01.11.2014)
Published in Advances in structural engineering (01.11.2014)
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Journal Article