Effect of porosity on reducing cohesive strength and accelerating crack growth in ultra low-k thin-films [IC interconnect applications]
Guyer, E.P., Dauskardt, R.H.
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (2005)
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (2005)
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Conference Proceeding
UV Curing Effects on Glass Structure and Mechanical Properties of Organosilicate Low-k Thin Films
Gage, D.M., Guyer, E.P., Stebbins, J.F., Zhenjiang Cui, Amir Al-Bayati, Demos, A., MacWilliams, K.P., Dauskardt, R.H.
Published in 2006 International Interconnect Technology Conference (2006)
Published in 2006 International Interconnect Technology Conference (2006)
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Conference Proceeding