Underflow process for direct-chip-attachment packaging
Lehmann, G.L., Driscoll, T., Guydosh, N.R., Li, P.C., Cotts, E.J.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.06.1998)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.06.1998)
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