A kinetic model of copper-to-copper direct bonding under thermal compression
Shie, Kai-Cheng, Gusak, A.M., Tu, K.N., Chen, Chih
Published in Journal of materials research and technology (01.11.2021)
Published in Journal of materials research and technology (01.11.2021)
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Journal Article
Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
Yao, Yifan, Gusak, A.M., Chen, Chih, Liu, Yingxia, Tu, K.N.
Published in Scripta materialia (01.09.2024)
Published in Scripta materialia (01.09.2024)
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Void ripening in Cu-Cu bonds
Liu, Hung-Che, Gusak, A.M., Tu, K. N., Chen, Chih
Published in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (05.10.2021)
Published in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (05.10.2021)
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Conference Proceeding
Interfacial void ripening in CuCu joints
Liu, Hung-Che, Gusak, A.M., Tu, K.N., Chen, Chih
Published in Materials characterization (01.11.2021)
Published in Materials characterization (01.11.2021)
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Interfacial void ripening in Cu Cu joints
Liu, Hung-Che, Gusak, A.M., Tu, K.N., Chen, Chih
Published in Materials characterization (01.11.2021)
Published in Materials characterization (01.11.2021)
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Journal Article
Evolution of interfacial voids in Cu-to-Cu joints
Liu, Hung-Che, Yang, Shih-Chi, Ong, Jia-Juen, Tran, Dinh-Phuc, Gusak, A.M., Tu, K.N., Chen, Chih
Published in Materials characterization (01.08.2022)
Published in Materials characterization (01.08.2022)
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Journal Article
Pseudopartial wetting of WC/WC grain boundaries in cemented carbides
Straumal, B.B., Konyashin, I., Ries, B., Straumal, A.B., Mazilkin, A.A., Kolesnikova, K.I., Gusak, A.M., Baretzky, B.
Published in Materials letters (15.05.2015)
Published in Materials letters (15.05.2015)
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Journal Article