Thermal Modeling of GaN HEMT Devices With Diamond Heat-Spreader
Mahrokh, M., Yu, Hongyu, Guo, Yuejin
Published in IEEE journal of the Electron Devices Society (2020)
Published in IEEE journal of the Electron Devices Society (2020)
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Journal Article
Advanced Au-Au Direct Bonding for Enhanced Thermal Management in Heterogeneous Integration
Shou, Tao, Cheng, Lu, Zhang, Chengxin, Guo, Yuejin
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Pressureless In-air Sintered Silver Bonding Bare Silicon Die on Silver-metallized Heat Spreader
Liu, Dong, Wu, Xinyi, Cheng, Lu, Chen, Quan, Zhang, Chengxin, Guo, Yuejin
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Electron-phonon interactions and superconductivity in K3C60
Chen, G, Guo, Y, Karasawa, N, Goddard, 3rd, WA
Published in Physical review. B, Condensed matter (01.11.1993)
Published in Physical review. B, Condensed matter (01.11.1993)
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Journal Article
Fan-out packaging method and fan-out packaging plate
Guo, Yuejin, Prack, Edward, Pi, Yingjun, Liu, Junjun, Hu, Chuan, Yan, Yingqiang
Year of Publication 25.07.2023
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Year of Publication 25.07.2023
Patent
Methods for making three-dimensional module
Guo, Yuejin, Zhang, Guobiao, Yu, Hongyu, Chen, Kai, Lan, Jun, Li, Yida, Zhou, Shengming
Year of Publication 28.03.2023
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Year of Publication 28.03.2023
Patent
HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM
Guo, Yuejin, An, Fengwei, Zhang, Guobiao, Shen, Mei, Quan, Tai, Xiang, Xiaodong
Year of Publication 08.12.2022
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Year of Publication 08.12.2022
Patent